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A Novel Vertical Grid Transferring Technique to Prepare 3D TEM Sample from Lift-Out Sample

Published online by Cambridge University Press:  01 August 2005

N Wang ,
J Wu  and
S Daniel
N Wang
Affiliation:
Cypress Semiconductor
J Wu
Affiliation:
Cypress Semiconductor
S Daniel
Affiliation:
Cypress Semiconductor

Extract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2005 in Honolulu, Hawaii, USA, July 31--August 4, 2005

Type
Research Article
Information
Microscopy and Microanalysis , Volume 11 , Issue S02 , August 2005 , pp. 2100 - 2101
Copyright
© 2005 Microscopy Society of America