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New Generalized Method for the TEM Examination of Buried Interfaces with Application to the Copper Bond Wire - Aluminum Pad System

Published online by Cambridge University Press:  08 April 2017

B Tracy ,
A delRosario ,
M Sidorov ,
S Li ,
F Classe ,
J Yeoh  and
S Gaddamraja
B Tracy
Affiliation:
Spansion LLC
A delRosario
Affiliation:
Spansion LLC
M Sidorov
Affiliation:
Spansion LLC
S Li
Affiliation:
Spansion LLC
F Classe
Affiliation:
Spansion LLC
J Yeoh
Affiliation:
Spansion LLC, Malaysia
S Gaddamraja
Affiliation:
Spansion LLC

Extract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

Type
Abstract
Information
Microscopy and Microanalysis , Volume 17 , Supplement S2 , July 2011 , pp. 686 - 687
Copyright
Copyright © Microscopy Society of America 2011