Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds

A.R. Zbrzezny

doi:10.1017/S1431927602107719

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Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds

Published online by Cambridge University Press: 01 August 2002

A.R. Zbrzezny

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A.R. Zbrzezny*: Affiliation:
University of Toronto, Materials Science and Engineering, Toronto, Canada, M5S 3E4

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Type: Abstract
Information: Microscopy and Microanalysis , Volume 8 , Issue S02 , August 2002 , pp. 1456 - 1457

DOI: https://doi.org/10.1017/S1431927602107719 [Opens in a new window]
Copyright: Copyright © Microscopy Society of America 2002

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Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds

Volume 8, Issue S02
A.R. Zbrzezny ^(a1)
DOI: https://doi.org/10.1017/S1431927602107719

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Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds

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