Hostname: page-component-848d4c4894-mwx4w Total loading time: 0 Render date: 2024-06-21T03:30:59.670Z Has data issue: false hasContentIssue false
  • English
  • Français

Electron Microscopy and Spectroscopy Characterization of the Effects of Annealing on the Cu/Graphene/Si Multilayer Thin Films

Published online by Cambridge University Press:  05 August 2019

Dibyesh Shrestha ,
Nicholas Ries ,
Otto Zietz ,
James Barnes ,
Andrea Goforth ,
Zhiqiang Chen  and
Jun Jiao
Dibyesh Shrestha
Affiliation:
Department Mechanical & Materials Engineering, Portland State University, Portland, Oregon 97207
Nicholas Ries
Affiliation:
Department Mechanical & Materials Engineering, Portland State University, Portland, Oregon 97207
Otto Zietz
Affiliation:
Department Mechanical & Materials Engineering, Portland State University, Portland, Oregon 97207
James Barnes
Affiliation:
Department of Chemistry, Portland State University, Portland, Oregon 97201
Andrea Goforth
Affiliation:
Department of Chemistry, Portland State University, Portland, Oregon 97201
Zhiqiang Chen
Affiliation:
Department Mechanical & Materials Engineering, Portland State University, Portland, Oregon 97207
Jun Jiao*
Affiliation:
Department Mechanical & Materials Engineering, Portland State University, Portland, Oregon 97207 Department of Chemistry, Portland State University, Portland, Oregon 97201
*
*jiaoj@pdx.edu

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
In situ TEM of Nanoscale Materials and Electronic Devices for Phase Transformation Studies
Information
Microscopy and Microanalysis , Volume 25 , Supplement S2 , August 2019 , pp. 1918 - 1919
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Nguyen, B.S., Lin, J.F., Perng, D.C., Appl. Phys. Lett., Perng. 104, 082106 (2014)Google Scholar
[2] Hong, J., Lee, S., Lee, S., Han, H., Mahata, C., Yeon, H.W., Koo, B., Kim, S., Nam, T., Byun, K., Min, B.W, Kim, Y.W., Kim, H., Joo, Y.C., Lee, T.. Nanoscale. 6, 7503 (2014).Google Scholar
[3]The authors would like to thank Intel, Oregon Metal Initiative, and NSF under award No. ECS-1711994 for the supportGoogle Scholar