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Detailed Microstructure Characterizations of BEOL Cu Interconnects

Published online by Cambridge University Press:  01 August 2018

Bianzhu Fu ,
Michael A. Gribelyuk  and
Seungman Choi
Bianzhu Fu
Affiliation:
CCA Characterization, GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY12020 Currently at: Entegris Inc., 7 Commerce Dr., Danbury, CT06810
Michael A. Gribelyuk
Affiliation:
ATD Characterization, GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY12020
Seungman Choi
Affiliation:
Quality and Reliability Assurance, GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY12020

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 2188 - 2189
Copyright
© Microscopy Society of America 2018 

References

[1] Lienig, J. "Introduction to Electromigration-Aware Physical Design". Proc. of the Int. Symposium on Physical Design (ISPD) 2006) p. 39.Google Scholar
[2] Hu, C. K., Gignac, L. Rosenberg, R. Microelectron. Reliab. 46 2006) p. 213.Google Scholar
[3] Changsup Ryu, Alvin L. S. Loke, Takeshi Nogami, Wong, S. Simon “Effect of Texture on the Electromigration of CVD Copper”. Proceedings of IEEE International Reliability Physics Symposium 1997) p. 201.Google Scholar
[4] Vincent, R, et al, Ultramicroscopy 53 1994) p. 271.Google Scholar
[5] The authors acknowledge Brian Popielarski, Craig Petrask, Sylvester Amoah, Albert Amann III, and Michael D’Aniello for preparing TEM samples.Google Scholar