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Creep Deformation Microstructures in DS Nb-Hf-Ti-Si In-Situ Composites

Published online by Cambridge University Press:  02 July 2020

S.D. Sitzman
Affiliation:
General Electric Corporate Research and Development, Schenectady, New York, 12301
B.P. Bewlay
Affiliation:
General Electric Corporate Research and Development, Schenectady, New York, 12301
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Extract

Directionally solidified (DS) in-situ composites based on (Nb) and (Nb) silicides, such as Nb5Si3 and Nb3Si, are presently under investigation as high-temperature structural materials [1, 2]. Alloying additions of elements such as Hf, Ti and Mo to these silicides are also being explored. The present paper describes the microstructure of a DS Nb-silicide based composite before and after creep deformation.

Alloys were prepared from high purity elements (>99.9%) using induction levitation melting in a segmented water-cooled copper crucible. The alloys were directionally solidified using the Czochralski method [2]. Creep tests were conducted at 1200°C to 50% deformation. Characterization was performed using scanning electron microscopy, electron microprobe analysis (EMPA), and electron backscatter diffraction pattern analysis (EBSP).

Type
Electron diffraction in the SEM: automated EBSP and its application
Copyright
Copyright © Microscopy Society of America

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References

references

1.Jackson, M.R., Bewlay, B.P., Rowe, R.G., Skelly, D.W., and Lipsitt, H.A., JOM 48 (1996)3839Google Scholar
2.Bewlay, B.P., Jackson, M.R. and Lipsitt, H.A., Metall. and Mater. Trans., 219 (1996)38013808CrossRefGoogle Scholar