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Correlation of Joule Heating and Electromigration-induced Mass Transport within Nanoscale Co Interconnects by In Situ STEM

Published online by Cambridge University Press:  30 July 2020

Brian Zutter ,
Matthew Mecklenburg ,
Ho Leung Chan  and
B. C. Regan
Brian Zutter
Affiliation:
Department of Physics & Astronomy, University of California, Los Angeles, Los Angeles, California, United States
Matthew Mecklenburg
Affiliation:
University of Southern California, Los Angeles, California, United States
Ho Leung Chan
Affiliation:
Department of Physics & Astronomy, University of California, Los Angeles, Los Angeles, California, United States
B. C. Regan
Affiliation:
Department of Physics & Astronomy, University of California, Los Angeles, Los Angeles, California, United States

Abstract

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Type
Advances in Electron Microscopy to Characterize Materials Embedded in Devices
Information
Microscopy and Microanalysis , Volume 26 , Supplement S2 , August 2020 , pp. 152 - 154
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Copyright
Copyright © Microscopy Society of America 2020

References

Griggio, F. et al. , IEEE International Reliability Physics Symposium (2018), p. 6E.3 1-5Google Scholar
der Veen, V. et al. , IEEE International Interconnect Technology Conference (2018), p. 172-174.Google Scholar
Engler, B. and Hull, R., Microscopy and Microanalysis. 25 (2019), p. 1902-1903.10.1017/S1431927619010249CrossRefGoogle Scholar
Mecklenburg, et al. Science. 347 (2015), p. 629-632.10.1126/science.aaa2433CrossRefGoogle Scholar
Mecklenburg, et al. Physical Review Applied. 9 (2018), p. 014005 1-7.10.1103/PhysRevApplied.9.014005CrossRefGoogle Scholar
Reimer, L. and Kohl, H., Transmission Electron Microscopy. (2008), p. 171.Google Scholar
Van Gurp, G. J., Thin Solid Films. 38 (1976 ), p. 295-311.10.1016/0040-6090(76)90008-0CrossRefGoogle Scholar
This work was supported by SRC NMP 2872.001, NSF STC award DMR-1548924 (STROBE), by NSF award DMR-1611036. Data presented here were acquired at the Core Center of Excellence in Nano Imaging (CNI) at the University of Southern California.Google Scholar