Hostname: page-component-848d4c4894-tn8tq Total loading time: 0 Render date: 2024-06-25T23:04:56.793Z Has data issue: false hasContentIssue false
  • English
  • Français

Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development

Published online by Cambridge University Press:  01 August 2018

Tzu-Ting Chou ,
Rui-Wen Song  and
Jenq-Gong Duh
Tzu-Ting Chou
Affiliation:
Dept. of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan.
Rui-Wen Song
Affiliation:
Dept. of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan.
Jenq-Gong Duh
Affiliation:
Dept. of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan.

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 618 - 619
Copyright
© Microscopy Society of America 2018