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An Investigation of Plastic Strain in Copper by Automated-EBSP

Published online by Cambridge University Press:  02 July 2020

J. A. Sutliff
J. A. Sutliff*
Affiliation:
GE Corporate R&D Center, 1 Research Circle, Niskayuna, NY12309
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Extract

This work describes the investigation of plastic strain in tensile deformed polycrystalline copper using the automated Electron BackScatter Pattern (EBSP) technique of electron diffraction in the Scanning Electron Microscope (SEM). A strong correlation was found between the known accumulated plastic strain in OFHC copper tensile specimens and quantitative measurements of intra-grain misorientation obtained from an analysis of automated-EBSP data.

Previous works on strain measurement using EBSP analysis have focused on the influence of dislocation density on the intensity profiles of diffraction bands. It is known that for some materials, like copper, deformation strain produces highly organized dislocation structures and thus the dislocation density is very inhomogeneous on the sub-micron scale probed by EBSP. This suggests that plastic strain analysis using the EBSP dislocation density analysis route will be difficult to reliably implement in these materials.

Type
Electron diffraction in the SEM: automated EBSP and its application
Information
Microscopy and Microanalysis , Volume 5 , Issue S2: Proceedings: Microscopy & Microanalysis '99, Microscopy Society of America 57th Annual Meeting, Microbeam Analysis Society 33rd Annual Meeting, Portland, Oregon August 1-5, 1999 , August 1999 , pp. 236 - 237
Copyright
Copyright © Microscopy Society of America

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References

references

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4.Sutliff, J. A., publication in preparation.Google Scholar
5. This work was made possible by the valuable help of Prof. Matthew Miller and his graduate student Heshan Gunawardane of Cornell University and Scott Sitzman of GE Corporate R&D.Google Scholar