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Accelerated Electromigration Study of Cobalt Thin Films by In-Situ TEM

Published online by Cambridge University Press:  05 August 2019

Brent Engler  and
Robert Hull
Brent Engler*
Affiliation:
Rensselaer Polytechnic Institute, Materials Science and Engineering, Troy NY, USA
Robert Hull
Affiliation:
Rensselaer Polytechnic Institute, Materials Science and Engineering, Troy NY, USA
*
*Corresponding author: engleb2@rpi.edu

Abstract

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Type
In situ TEM of Nanoscale Materials and Electronic Devices for Phase Transformation Studies
Information
Microscopy and Microanalysis , Volume 25 , Supplement S2 , August 2019 , pp. 1902 - 1903
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Van der Veen, et al. , 2018 IEEE International Interconnect Technology Conference (2018), p 172-4Google Scholar
[2]Hu, C.K. et al. , IEEE International Reliability Physics Symposium Proceedings (2018), p 4F.11-4F.16Google Scholar
[3]Gall, D., Journal of Applied Physics 119 (2016), p 085101 (5 pp.)Google Scholar
[4]Van Gurp, G.J., Journal of Physics and Chemistry of Solids 38 (1977), p 627-633Google Scholar
[5]Van Grup, G.J., Thin Solid Films 38 (1976), p 295-311Google Scholar
[6]This work was supported by the NYSTAR Focus Center at RPI, C150117, and made extensive use of cleanroom and characterization facilities in the Center for Materials, Devices and integrated Systems (cMDIS) at RPI.Google Scholar