Hostname: page-component-8448b6f56d-xtgtn Total loading time: 0 Render date: 2024-04-20T10:54:33.397Z Has data issue: false hasContentIssue false
  • English
  • Français

The Endochronic Viscoplasticity for Sn/3.9Ag/0.6Cu Solder Under Low Strain Rate Fatigue Loading Coupled with Thermal Cycling

Published online by Cambridge University Press:  05 May 2011

C. F. Lee ,
Z. H. Lee  and
S. H. Ou
C. F. Lee*
Affiliation:
Department of Engineering Science College of Engineering, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
Z. H. Lee*
Affiliation:
Department of Engineering Science College of Engineering, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
S. H. Ou*
Affiliation:
Department of Engineering Science College of Engineering, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
*
* Professor
** Graduate Students
** Graduate Students
Get access

Abstract

In this paper a wide range of temp. dependent kernel function ρ(Z) and the strain-rate function h(, T) in the Endochronic viscoplasticity were established first by using experimental steady hysteresis loops of Wei et. al., for Sn/3.9Ag/0.6Cu Solder at fixed 298K or 373K and strain rate at 10−3, 10−4 and 10−51/s; and then extended to predict the thermomechanical behavior of solder under constant low strain rate (10−51/s), from 0 to 1% max. strain fatigue loading with in-phase thermal cycling between 298K and 373K.

A novel approach in the theory to account for the microstructural changes enhanced by the stressassisted grain boundary diffusion mechanism during thermal cycling was proposed by using a partial relaxation function h1(T) of back stress (i.e. ρ0 in ρ(Z)).The theoretical results were in very well agreement with experimental data. These results and the out-phase results from the present theory were new and might be used as references to compare with results derived from other theories.

Keywords

Endochronic viscoplasticitySn/3.9Ag/0.6Cu solderFatigue loading coupled with thermal cyclingA partial relaxation function of back stressMicrostructural changes
Type
Articles
Information
Journal of Mechanics , Volume 25 , Issue 3 , September 2009 , pp. 261 - 270
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Fix, A. R. and Nüchter, W., “Microstructural Changes of Lead-Free Solder Joints During Long-Term Aging, Thermal Cycling and Vibration Fatigue,” J. Soldering andSurface Mount Technology, 20/1, pp. 13–21 (2008).Google Scholar
2.Lau, J., Dauksher, W. and Vianco, P., “Acceleration Models, Constitutive Equations, and Reliability of Lead-Fee Solders and Joints,” Electronic Components and Technology Conf. IEEE, pp. 229–236 (2003).Google Scholar
3.Lee, C. F. and Shieh, T. J., “Theory of Endochronic Cyclic Viscoplasticity of Eutectic Tin/Lead Solder Alloy,” Journal of Mechanics, 22, pp. 181–191 (2006).Google Scholar
4.Lee, C. F. and Chen, Y. C., “Thermodynamic Formulation of Endochronic Cyclic Viscoplasticity with Damage-Application to Eutectic Sn/Pb Solder Alloy,” Journal of Mechanics, 23, pp. 433–444 (2007).CrossRefGoogle Scholar
5.Wei, Y., Lau, K. J., Vianco, P. and Fang, H. E., “Behavior of Lead-Free Solder Under Thermomechanical Loading,” ASME J. Electronic Packaging., 126, pp. 367–373 (2004).Google Scholar
6.Wei, Y., Chow, C. L., Vianco, P. and Fang, H. E., “Isothermal Fatigue Damage Model for Lead-free Solder,” J. Damage Mechanics, 15, pp. 109–119 (2006).Google Scholar
7.Lee, C. F. and Lee, Z. H., “Predicting Fatigue Initiation Life of Sn/3.8Ag/0.7Cu Solder Using Endochronic Cyclic Damage-Coupled Viscoplastic Theory,” Journal of Mechanics, 24, pp. 369–377 (2008).Google Scholar
8.Valanis, K. C.“A theory of viscoplasticity Without a Yield Surface Part I. General Theory,” Archives of Mechanics, 51, pp. 367–374 (1984).Google Scholar
9.Valanis, K. C. and Lee, C. F., “Endochronic Theory of Cyclic Plasticity with Applications,” ASME J. of Applied Mechanics, 51, pp. 367–374 (1984).CrossRefGoogle Scholar
10.Lee, C. F., “A Systematic Method of Determining Material Functions in the Endochronic Plasticity,” J. the Chinese Society of Mechanical Engineers, 8, pp. 419–430 (1987).Google Scholar
11.Valanis, K. C. and Lee, C. F., “Some Recent Development of the Endochronic Theory with Applications,” Nuclear Engnr. and Design, 69, pp. 327–344 (1982).CrossRefGoogle Scholar