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The Atomistic Study on Thermal Transport of the Branched Cnt

Published online by Cambridge University Press:  10 August 2020

Wei-Jen Chen
Affiliation:
Department of Mechanical Engineering National Cheng Kung UniversityTainan, Taiwan
I-Ling Chang*
Affiliation:
Department of Mechanical Engineering National Cheng Kung UniversityTainan, Taiwan
*
*Corresponding author (ilchang@mail.ncku.edu.tw)

Abstract

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In this research, the thermal transport behavior of the branched carbon nanotube (CNT) with T-junction was investigated using non-equilibrium molecular dynamics simulation. Both symmetric and asymmetric temperature-controlled simulations were imposed to evaluate how the heat flowed inside the branched CNT with three branches of equal length and same chirality. The branch length and strain effects on the heat flow were examined. In addition, the simulated heat flow was compared with the prediction made by conventional thermal circuit calculation based on diffusive phonon transport. The heat was observed to flow straight rather than sideway inside the branched CNT with T-junction under the asymmetric temperature setup; this finding contradicts the conventional thermal circuit calculation. There are two possible explanations for this phenomenon. One is ballistic phonon transport and the other is phonons have different interactions or scattering with the defective atomic configurations at the T-junction. Moreover, the tensile strain could tune the heat flow, a finding that might be useful in thermal management applications.

Type
Research Article
Creative Commons
Creative Common License - CCCreative Common License - BY
This is an Open Access article, distributed under the terms of the Creative Commons Attribution licence (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted re-use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright
© The Author(s), 2020. Published by Cambridge University Press

References

REFERENCES

Berber, S., Kwon, Y. K. and Tománek, D., Physical Review Letters, 84, pp. 4613 (2000).CrossRefGoogle Scholar
Ruoff, R. S. and Lorents, D. C., Carbon, 33, pp. 925 (1995).CrossRefGoogle Scholar
Vollebregt, S.et al., Journal of Applied Physics, 116, pp. 023514 (2014).CrossRefGoogle Scholar
Gharib-Zahedi, M. R., Tafazzoli, M., Bohm, M. C. and Alaghemandi, M., The Journal of Chemical Physics, 139, pp. 184704 (2013).CrossRefGoogle Scholar
Park, J. and Prakash, V., Journal of Materials Research, 28, pp. 940 (2012).10.1557/jmr.2012.395CrossRefGoogle Scholar
Shi, J., Dong, Y., Fisher, T. and Ruan, X., Journal of Applied Physics, 118, pp. 044302 (2015).10.1063/1.4927273CrossRefGoogle Scholar
Shi, J., Zhong, Y., Fisher, T. S. and Ruan, X., ACS Applied Materials & Interfaces, 10, pp. 15226 (2018).10.1021/acsami.8b00826CrossRefGoogle Scholar
Gonzalez Noya, E., Srivastava, D. and Menon, M., Physical Review B, 79, pp. 115432 (2009).CrossRefGoogle Scholar
Park, J., Lee, J. and Prakash, V., Journal of Nanoparticle Research, 17, pp. 59 (2015).CrossRefGoogle Scholar
Alaghemandi, M., Muller-Plathe, F. and Bohm, M. C., Journal of Chemical Physics, 135, pp. 184905 (2011).CrossRefGoogle Scholar
Chen, J.et al., ACS Applied Materials & Interfaces, 4, pp. 81 (2012).CrossRefGoogle Scholar
Aitkaliyeva, A., Chen, D. and Shao, L., Scientific Reports, 3, pp. 2774 (2013).CrossRefGoogle Scholar
Lian, F., Llinas, J. P., Li, Z., Estrada, D. and Pop, E., Applied Physics Letters, 108, pp. 103101 (2016).CrossRefGoogle Scholar
Kaskela, A.et al., Nano Letters, 10, pp. 4349 (2010).CrossRefGoogle Scholar
Sun, D. M.et al., Nature Nanotechnology, 6, pp. 156 (2011).CrossRefGoogle Scholar
Hu, J., Ouyang, M., Yang, P. and Lieber, C. M., Nature, 399, pp. 399 (1999).CrossRefGoogle Scholar
Aiyiti, A.et al., Carbon, 140, pp. 673 (2018).CrossRefGoogle Scholar
Li, Y.-L., Kinloch, I. A. and Windle, A. H., Science China Technological Sciences, 304, pp. 276 (2004).Google Scholar
Ma, X. and Wang, E. G., Applied Physics Letters, 78, pp. 4 (2001).Google Scholar
Terrones, M., Banhart, F., Grobert, N., Charlier, J. C., Terrones, H. and Ajayan, P., Physical Review Letters, 89, pp. 075505 (2002).CrossRefGoogle Scholar
Srivastava, D., Menon, M. and Ajayan, P. M., Journal of Nanoparticle Research, 5, pp. 395 (2003).CrossRefGoogle Scholar
Li, W., Fong, Y., Tong, Z. and Zhang, S., Acta Physica Sinica, 62, pp. 076107 (2013).Google Scholar
Zhang, Z., Kutana, A., Roy, A. and Yakobson, B. I., The Journal of Physical Chemistry C, 121, pp. 1257 (2017).CrossRefGoogle Scholar
Stuart, S. J., Tutein, A. B. and Harrison, J. A., Journal of Chemical Physics, 112, pp. 6472 (2000).CrossRefGoogle Scholar
Shiomi, J. and Maruyama, S., Japanese Journal of Applied Physics, 47, pp. 2005 (2008).CrossRefGoogle Scholar
Hone, J., Whitney, M., Piskoti, C. and Zettl, A., Physical Review B, 59, pp. R2514 (1999).CrossRefGoogle Scholar
Ren, C., Zhang, W., Xu, Z., Zhu, Z. and Huai, P., The Journal of Physical Chemistry C, 114, pp. 5786-5791 (2010).10.1021/jp910339hCrossRefGoogle Scholar
Marconnet, A. M., Panzer, M. A. and Goodson, K. E., Reviews of Modern Physics, 85, pp. 1295-1326 (2013).CrossRefGoogle Scholar
Zhang, K., Fan, H. and Yuen, M. M. F., Proceedings of the International Conference on Electronic Materials and Packaging, pp. 1-4 (2006).Google Scholar