Hostname: page-component-848d4c4894-8kt4b Total loading time: 0 Render date: 2024-07-01T21:42:20.905Z Has data issue: false hasContentIssue false
  • English
  • Français

Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Published online by Cambridge University Press:  03 March 2011

Jin-Wook Jang ,
Ananda P. De Silva ,
Jong-Kai Lin  and
Darrel R. Frear
Jin-Wook Jang*
Affiliation:
Freescale Semiconductor Corporation, 2100 East Elliot Road, Tempe, Arizona 85284
Ananda P. De Silva
Affiliation:
Freescale Semiconductor Corporation, 2100 East Elliot Road, Tempe, Arizona 85284
Jong-Kai Lin
Affiliation:
Freescale Semiconductor Corporation, 2100 East Elliot Road, Tempe, Arizona 85284
Darrel R. Frear
Affiliation:
Freescale Semiconductor Corporation, 2100 East Elliot Road, Tempe, Arizona 85284
*
a)Address all correspondence to this author.e-mail: j.jang@freescale.com
Get access

Abstract

The tensile fracture behavior for solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps was examined. The annealing temperatures were in the range of 125–170 °C for 500 h. Prior to solid state annealing, the eutectic Sn–37Pb (SnPb) and Sn–0.7Cu (SnCu) solders showed fracture through the bulk solder. Brittle interfacial fracture occurred in the Sn–3.5Ag (SnAg) solder. After solid-state annealing, the fracture behavior changed dramatically. For eutectic SnPb solder, the fracture modes gradually changed from cohesive solder failure to interfacial fracture with increasing annealing temperature. The fracture mode of the SnCu solder showed greater change than the SnPb and SnCu solders. After annealing at 125 °C, the SnAg solder had a ductile taffy pull fracture, but an increase in temperature resulted in brittle interfacial fracture again. The SnCu solder maintained the same ductile taffy pull mode up to170 °C annealing, independent of the under bump metallization (UBM) type. Microstructure analysis showed that the interfacial fracture of the SnPb and SnAg solder bumps was ascribed to Pb-rich layer formation and Ag embrittlement at the interface, respectively. The bulk solder fracture of SnAg annealed at 125 °C appeared to be a transient phenomenon due to the abrupt breakdown of the hard lamella structure. The eutectic SnCu solder bumps had no significant change in the interfacial structure, except for interfacial intermetallic growth.

Keywords

Solid state annealingFracture modesMicrostructure
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 6 , June 2004 , pp. 1826 - 1834
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1International Technology Roadmap for Semiconductors (Semiconductor Industry Association, San Jose, CA, 2001).Google Scholar
2Chang, C.S., Oscilowski, A. and Bracken, R. C.: Future challenges in electronics packaging. IEEE Circuits Device Mag. 14, 45 (1998).CrossRefGoogle Scholar
3Cannis, J.: Green IC packaging. Adv. Packaging 10, 38 (2001).Google Scholar
4Abtew, M. and Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng. R2795(2000).Google Scholar
5Jackson, G.J., Durairaj, R., and Ekere, N.N.: Characterisation of lead-free solder pastes for low cost flip-chip bumping, inProc. 27th Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 2002 (IEEE, Piscataway, NY), pp. 223–228.CrossRefGoogle Scholar
6Jang, J.W., De Silva, A.P., Lee, T.Y., Lin, J.K. and Frear, D.R.: Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology. Appl. Phys. Lett. 79, 482 (2001).CrossRefGoogle Scholar
7Frear, D.R., Jang, J.W., Lin, J.K. and Zhang, C.: Pb-free solders for flip-chip interconnects. JOM 53, 28 (2001).CrossRefGoogle Scholar
8McCormack, M., Jin, S. and Kammlott, G.W.: Suppression of microstructural coarsening and creep deformation in a lead-free solder. Appl. Phys. Lett. 64, 580 (1994).CrossRefGoogle Scholar
9Hwang, J.S., Guo, Z. and Koenigsmann, H.: High-strength and high-fatigue-resistant lead-free solder. Surface Mount Technology 14, 55 (2000).Google Scholar
10 J.S. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing, (McGraw Hill, New York, 1996), Chap. 3.CrossRefGoogle Scholar
11Yang, W., Messler, R.W. and Jr., : Microstructure evolution of eutectic Sn-Ag solder joints. J. Electron. Mater. 23, 765 (1994).CrossRefGoogle Scholar
12López Hirata, V.M. and Hirano, K.: Ostwald ripening of -Fe precipitates in a Cu-1.5 at.% Fe alloy.Scripta Metall. 31, 117 (1994).CrossRefGoogle Scholar
13Kim, D.M. and Ardell, A.J.: Coarsening of Ni3Ge in binary Ni–Ge alloys: Microstructures and volume fraction dependence of kinetics. Acta Mater. 51, 4073 (2003).CrossRefGoogle Scholar
14Lee, T.Y., Choi, W.J., Tu, K.N., Jang, J.W., Kuo, S.M., Lin, J.K., Frear, D.R., Zeng, K. and Kivilahti, J.K.: Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu. J. Mater. Res. 17, 291 (2002).CrossRefGoogle Scholar
15Ha, J.S., Oh, T.S. and Tu, K.N.: Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn-Cu solder and thin film metallization. J. Mater. Res. 18, 2109 (2003).CrossRefGoogle Scholar
16Kim, P.G., Jang, J.W., Lee, T.Y. and Tu, K.N.: Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils. J. Appl. Phys. 86, 6746 (1999).CrossRefGoogle Scholar
17Massalski, T.B.: Binary Alloy Phase Diagrams (ASM International, Materials Park, OH, 1990), Vol. 3.Google Scholar
18 J.K. Lin, A. De Silva, D. Frear, Y. Guo, J.W. Jang, L. Li, D. Mitchell, B. Yeung, and C. Zhang: Characterization of lead-free solders and under bump metallurgies for flip-chip package, in Proc. 51st Electronic Components and Technology Conference, Orlando, FL, May 2001 (IEEE, Piscataway, NY), p. 455.Google Scholar
19Guo, Y., Lin, J.K., and De Silva, A.: Reliability evaluations of chip interconnect in lead-free solder systems, inProc. 52nd Electronic Components and Technology Conference 2002,San Diego, CA, May 2002 (IEEE, Piscataway, NY), p. 1275.Google Scholar