Hostname: page-component-848d4c4894-mwx4w Total loading time: 0 Render date: 2024-06-19T17:52:52.962Z Has data issue: false hasContentIssue false
  • English
  • Français

Statistical behavior and misfit stresses in ceramic and metal laminated system

Published online by Cambridge University Press:  26 November 2012

D. Sherman  and
X. Gong
D. Sherman
Affiliation:
Department of Materials Engineering, Technion-Israel Institute of Technology, Haifa, 32000 Israel
X. Gong
Affiliation:
Department of Materials Engineering, Technion-Israel Institute of Technology, Haifa, 32000 Israel
Get access

Abstract

The statistical behavior of ceramic and metal laminates was studied, and in particular the relationship between the failure distribution of the laminate and that of the ceramic layers that it comprises. An important result of this investigation is the ability to predict the misfit stresses due to thermal processing of the laminates. A finite different scheme that was capable of calculating the local stresses at each constituent and of considering the thermal residual stresses was developed. The laminated system was constructed from 380-μm-thick alumina alternating with nickel foil 25- or 50-μm thick.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 3 , March 2001 , pp. 721 - 727
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Weibull, W., Swed. Ins. Eng. Res. Proc. 151, 1–45 (1939).Google Scholar
2.Lewis, D., Am. Ceram. Soc. Bull. 61, 1208–1214 (1982).Google Scholar
3.Hanney, M.J. and Morrell, R., Proc. Br. Ceram. Soc. 13, 277 (1982).Google Scholar
4.Davidge, R.W., Mechanical Behavior of Ceramics (Cambridge University Press, Cambridge, 1979).Google Scholar
5.Lewis, D. III and Oyler, S.M., J. Am. Ceram. Soc. 59, 289–307 (1976).Google Scholar
6.Seidel, J., Claussen, N., and Rodel, J., J. Europ. Ceram. Soc. 15, 395–404 (1995).CrossRefGoogle Scholar
7.Lube, T. and Manner, M., Key Eng. Mater. 132, 488–491 (1997).Google Scholar
8.Soyez, G., Elssner, G., and Ruhle, M., J. Mater. Sci. 35, 1087–1096 (2000).Google Scholar
9.Evans, A.G. and Hutchinson, J.W., Acta Metal. 43, 2507 (1995).Google Scholar
10.Evans, A.G., Hutchinson, J.W., and Wei, Y., Acta Mater. 47, 4093–4113 (1999).Google Scholar
11.Timoshenko, S., J. Opt. Soc. Am. 11, 233–255 (1925).Google Scholar
12.Bagchi, A., Lucas, G.E., Suo, Z., and Evans, A.G., J. Mater. Res. 9, 1734–1741 (1994).Google Scholar
13.Sherman, D. and Schlumm, D., J. Mater. Res. 3, 751 (2001).Google Scholar
14.Locatelli, M.R., Tomsia, A.P., Nakashima, K., Dalgleish, B.J., and Glaeser, A.M., Key Eng. Mater. 111–112, 157–190 (1995).Google Scholar
15.Sherman, D., Mechanical Behavior of Alumina/Nickel Laminates under Thermal Shock from 1000 °C. In progress.Google Scholar
16.Metals Handbook, Desk Addition, edited by Boyer, H.E. and Gall, T.L. (American Society of Metals, 1985), p. 1522.Google Scholar