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Spherical indentation of an elastic bilayer: A modification of the perturbation approach

Published online by Cambridge University Press:  31 January 2011

Jae Hun Kim ,
Chad S. Korach  and
Andrew Gouldstone
Jae Hun Kim
Affiliation:
Department of Materials Science and Engineering, Stony Brook University, Stony Brook, New York 11794-2275
Chad S. Korach
Affiliation:
Department of Mechanical Engineering, Stony Brook University, Stony Brook, New York 11794-2275
Andrew Gouldstone*
Affiliation:
Department of Mechanical and Industrial Engineering, Northeastern University, Boston, Massachusetts 02115-5000
*
a)Address all correspondence to this author. e-mail: agouldstone@coe.neu.edu
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Abstract

Accurate mechanical property measurement of films on substrates by instrumented indentation requires a solution describing the effective modulus of the film/substrate system. Here, a first-order elastic perturbation solution for spherical punch indentation on a film/substrate system is presented. Finite element method (FEM) simulations were conducted for comparison with the analytic solution. FEM results indicate that the new solution is valid for a practical range of modulus mismatch, especially for a stiff film on a compliant substrate. It also shows that effective modulus curves for the spherical punch deviates from those of the flat punch when the thickness is comparable to contact size.

Keywords

Elastic propertiesThin film
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 11 , November 2008 , pp. 2935 - 2943
Copyright
Copyright © Materials Research Society 2008

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References

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