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Slow and rapid cooling of Al–Cu–Si ultrafine eutectic composites: Interplay of cooling rate and microstructure in mechanical properties

Published online by Cambridge University Press:  12 February 2019

Guilherme Lisboa de Gouveia
Affiliation:
Department of Materials Engineering, Federal University of São Carlos, São Carlos, SP 13565-905, Brazil
Rafael Kakitani
Affiliation:
Department of Manufacturing and Materials Engineering, University of Campinas UNICAMP, Campinas, SP 13083-860, Brazil
Leonardo Fernandes Gomes
Affiliation:
Department of Materials Engineering, Federal University of São Carlos, São Carlos, SP 13565-905, Brazil
Conrado Ramos Moreira Afonso
Affiliation:
Department of Materials Engineering, Federal University of São Carlos, São Carlos, SP 13565-905, Brazil
Noé Cheung
Affiliation:
Department of Manufacturing and Materials Engineering, University of Campinas UNICAMP, Campinas, SP 13083-860, Brazil
José Eduardo Spinelli*
Affiliation:
Department of Materials Engineering, Federal University of São Carlos, São Carlos, SP 13565-905, Brazil
*
a)Address all correspondence to this author. e-mail: spinelli@ufscar.br
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Abstract

Ternary Al–15 wt% Cu–7 wt% Si and Al–22 wt% Cu–7 wt% Si alloy specimens were generated by transient directional solidification (DS) and rapid solidification (RS) techniques. The microstructures are constituted by an α-Al dendritic matrix surrounded by two eutectic, that is, a binary eutectic (Si + α-Al) and a bimodal eutectic, consisting of cellular-type binary eutectic colonies (α-Al + Al2Cu) in a ternary eutectic matrix consisting of α-Al + Al2Cu + Si. The bimodal eutectic exists at cooling rates from 0.5 to 250 K/s. The secondary dendritic spacing, λ2, of the DS samples varied from 5 to 20 μm and from 10 to 18 μm for both examined alloys. The λ2 from 2.7 to 4.0 μm characterized the RS samples. Mechanical properties have been determined for various samples related to different dendritic spacing values. Based on the evaluation of the rapidly solidified microstructures, it was possible to assess the cooling rates.

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Article
Copyright
Copyright © Materials Research Society 2019 

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