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Rapidly texturedBi2Sr2CaCu2O8

Published online by Cambridge University Press:  31 January 2011

S.R. Arrasmith ,
M.J. Kramer ,
B.D. Merkle ,
T.G. Holesinger  and
R.W. McCallum
S.R. Arrasmith
Affiliation:
Ames Laboratory, Iowa State University, Ames, Iowa 50011
M.J. Kramer
Affiliation:
Ames Laboratory, Iowa State University, Ames, Iowa 50011
B.D. Merkle
Affiliation:
Ames Laboratory, Iowa State University, Ames, Iowa 50011
T.G. Holesinger
Affiliation:
Argonne National Laboratory, Argonne, Illinois 60439
R.W. McCallum
Affiliation:
Ames Laboratory, Iowa State University, Ames, Iowa 50011
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Abstract

Amorphous Bi2Sr2CaCu2O8 (Bi-2212) was crystallized under uniaxial loads (up to 1500 N) at temperatures up to 890 °C to induce texture. Well-textured samples (19 mm in diameter and 0.15 mm thick) were obtained for samples heated to 890 °C and quenched. Heated (10 °C/min) and quenched samples at 550, 750, 850, and 870 °C demonstrate that the crystallization path is Bi2Sr2CuO6 (Bi-2201) (550 °C) to Bi-2212 (850 °C), with texturing occurring during grain growth (T > 850 °C). Comparison of samples crystallized under load and no load demonstrates that the texturing is a result of the plane stress biasing the normal anisotropic grain growth normal to the applied stress direction.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 6 , June 1993 , pp. 1247 - 1257
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1Deutscher, G., First Latin-American Conference on High-Temperature Superconductivity: Proceedings of the I LACHTS held in Rio de Janeiro, Brazil, May 4-6, 1990, edited by Nicolsky, R. (World Scientific, Singapore, NJ, 1988), pp. 27–36.Google Scholar
2Dinger, T. R., Dolan, G. J., Keane, D., McGuire, T. R., Worthington, T. K., Yandrofski, R. M., and Yeshurun, Y., High Temperature Superconducting Compounds: Processing & Related Properties, edited by Whang, S.H. and DasGupta, A. (The Minerals, Metals & Materials Society, Warrendale, PA, 1989), pp. 23–40.Google Scholar
3Chan, S-W., Hwang, D. M., Ramesh, R., Sampere, S. M., Nazar, L., Gerhardt, R., and Pruna, P., High Tc Superconducting Thin Films: Processing, Characterization and Applications, edited by Stockbaur, R. (American Institute of Physics, Columbus, OH, 1990), pp. 172–185.Google Scholar
4Murakami, M., Oyama, T., Fujimoto, H., Gotoh, S., Yamaguchi, K., Shiohara, Y., Koshizuaka, N., and Tanaka, S., IEEE Trans. Magn. 27, 1479–1486 (1991).CrossRefGoogle Scholar
5Finnemore, D.K., Shelton, R.N., Clem, J.R., McCallum, R.W., Ku, H.C., McCarley, R.E., Chen, S.C., Klavins, P., and Kogan, V., Phys. Rev. B 35, 5319–5322 (1987).CrossRefGoogle Scholar
6Larbalestier, D. C., Babcock, S. E., Cai, X., Daeumling, M., Hampshire, D. P., Kelly, T. F., Lavanier, L. A., Lee, P. J., and Suentjens, J., Physica C 153-155, 1580–1585 (1988).CrossRefGoogle Scholar
7Dinger, T.R., Worthington, T. K., Gallagher, W.J., and Sandstrom, R.L., Phys. Rev. Lett. 58, 2687–2690 (1987).CrossRefGoogle Scholar
8Roas, B., Schultz, L., and Saemann-Ischenko, G., Phys. Rev. Lett. 64, 479–482 (1990).CrossRefGoogle Scholar
9Hagan, C. W. and Griessen, R., Phys. Rev. Lett. 62, 2857–2860 (1989).CrossRefGoogle Scholar
10Biggs, B. D., Kunchur, M. N., Lin, J. J., Poon, S. J., Askew, T. R., Flippen, R. B., Subramanian, M. A., Gopalakrishnan, J., and Sleight, A. W., Phys. Rev. B 39, 7309–7312 (1989).CrossRefGoogle Scholar
11Jin, S., Dover, R.B. van, Tiefel, T.H., Graebner, J.E., and Spencer, N.D., Appl. Phys. Lett. 58, 868–870 (1991).CrossRefGoogle Scholar
12Moon, B. M., Kordas, G., Teepe, M. R., Kenzer, D. S., Jeng, Y. L., and Johnson, D.L., Proceedings of the Second International Conference on Electronic Materials, edited by Sugano, T., Chang, R. P.H., Kamimura, H., Hayashi, I., and Kamiya, T. (Mater. Res. Soc. Symp. Proc. ICEM-2, Pittsburgh, PA, 1990), pp. 39–44.Google Scholar
13Heine, K., Tenbrink, J., and Thoner, M., Appl. Phys. Lett. 55, 2441–2443 (1989).CrossRefGoogle Scholar
14Sandhage, K.H., Riley, G.N. Jr, and Carter, W.L., JOM 43, 21–25 (1991).CrossRefGoogle Scholar
15Enomoto, N., Kikuchi, H., Uno, N., Kumakura, H., Togano, K., and Watanabe, K., Jpn. J. Appl. Phys. 29, L447–L449 (1990).CrossRefGoogle Scholar
16Yamada, Y., Jikihara, K., Hasebe, T., Yanagiya, T., Yasuhara, S., Ishihara, M., Asano, T., and Tanaka, Y., Jpn. J. Appl. Phys. 29, L456–L458 (1990).CrossRefGoogle Scholar
17Yoshimura, M., Sung, T.H., Nakagawa, Z., and Nakamura, T., Jpn. J. Appl. Phys. 27, L1877–L1879 (1988).CrossRefGoogle Scholar
18Bayya, S. S., Kudesia, R., and Snyder, R. L., AIP Conference Proceedings 219: Superconductivity and Its Applications, held in Buffalo, NY, September 18-20, 1990, edited by Kao, Yi-Han, Coppens, P., and Kwok, Hoi-Sing, (American Institute of Physics, New York, 1991), pp. 306–314.Google Scholar
19Danusantoso, J. and Chaki, T. K., Supercon. Sci. Technol. 4, 509–519 (1991).CrossRefGoogle Scholar
20DeGuire, M. R., Bansal, N. P., and Kim, C. J., J. Am. Ceram. Soc. 73, 1165–1171 (1990).CrossRefGoogle Scholar
21Dimitriev, Y., Samuneva, B., Ivanova, Y., Gattef, E., Migailova, V., and Staneva, A., Supercon. Sci. Technol. 3, 606 (1990).CrossRefGoogle Scholar
22Hinks, D. G., Soderholm, L., Capone, D. W. II, Dabrowski, B., Mitchell, A. W., and Shi, D., Appl. Phys. Lett. 53, 423–425 (1988).CrossRefGoogle Scholar
23Holesinger, T. G., Miller, D. J., and Chumbley, L. S., J. Mater. Res. 7, 1658–1671 (1992).CrossRefGoogle Scholar
24Ibara, Y., Nasu, H., Imura, T., and Osaka, Y., Jpn. J. Appl. Phys. 28, L37–L40 (1989).CrossRefGoogle Scholar
25Inoue, A., Kimura, H., Matsuzaki, K., Tsai, A-P., and Masumoto, T., Jpn. J. Appl. Phys. 27, L941–L943 (1988).CrossRefGoogle Scholar
26Jacobs, K. R., Miller, T. A., Finnemore, D. K., Goldman, A. J., Lebeau, S. E., and Righi, J., IEEE Trans. Magn. 27, 917–919 (1991).CrossRefGoogle Scholar
27Komatsu, T., Sato, R., Imai, K., Matusita, K., and Yamashita, T., Jpn. J. Appl. Phys. 27, L550–L552 (1988).CrossRefGoogle Scholar
28Matheis, D. P., Snyder, R. L., and Hubbard, C. R., AIP Conference Proceedings 219: Superconductivity and Its Applications, held in Buffalo, NY, September 18-20, 1990, edited by Kao, Y-H., Coppens, P., and Kwok, H-S. (American Institute of Physics, New York, 1991), pp. 582–588.Google Scholar
29Miller, T. A., Sanders, S. C., Ostenson, J. E., Finnemore, D. K., LeBeau, S. E., and Righi, J., Appl. Phys. Lett. 56, 585–586 (1990).Google Scholar
30Minami, T., Akamatsu, Y., Tatsumisago, M., Tohge, N., and Kowada, Y., Jpn. J. Appl. Phys. 27, L777–L778 (1988).CrossRefGoogle Scholar
31Takei, H., Koike, M., Takeya, H., Suzuki, K., and Ichihara, M., Jpn. J. Appl. Phys. 28, L1193–L1196 (1989).CrossRefGoogle Scholar
32Yoshimura, M., Sung, T. H., Nakagawa, Z., and Nakamura, T., J. Mater. Sci. Lett. 8, 687–688 (1989).CrossRefGoogle Scholar
33Zheng, H., Hu, Y., and Mackenzie, J.D., Appl. Phys. Lett. 58, 1679–1681 (1991).CrossRefGoogle Scholar
34Yi, L.Z. and Persson, M., Supercon. Sci. Technol. 1, 198–200 (1988).Google Scholar
35Hettich, B., Freilinger, B., Majewski, P., Popp, T., and Schulze, K., Proceedings of ICMC '90 Topical Conference on Materials Aspects of High-Temperature Superconductors: High Temperature Superconductors Materials Aspects, held in Garmisch-Partenkirchen, FRG, May 9-11, 1990, edited by Freyhardt, H. C., Flukiger, R., and Peuckert, M. (Oberursel, Germany, 1991), p. 399–404.Google Scholar
36Holesinger, T. G., Miller, D. J., and Chumbley, L. S., High Temperature Superconducting Compounds III: Processing the Microstructure Property Relationships, edited by Whang, S.H., DasGupta, A., and Collings, E. (The Minerals, Metals & Materials Society, Warrendale, PA, 1991), pp. 433–446.Google Scholar
37Hong, B. and Mason, T. O., J. Am. Ceram. Soc. 74, 1045–1052 (1991).CrossRefGoogle Scholar
38Lee, C-L., Chen, J-J., Wen, W-J., Perng, T-P., Wu, J-M., Wu, T-B., Chin, T-S., Liu, R-S., and Wu, P-T., J. Mater. Res. 5, 1403–1408 (1990).CrossRefGoogle Scholar
39Majewski, P., Freilinger, B., Hettich, B., Popp, T., and Schulze, K., Proceedings of ICMC '90 Topical Conference on Materials Aspects of High-Temperature Superconductors: High Temperature Superconductors Materials Aspects, held in Garmisch-Partenkirchen, FRG, May 9-11, 1990, edited by Freyhardt, H. C., Flukiger, R., and Peuckert, M. (Oberursel, Germany, 1991), pp. 393–398.Google Scholar
40Schulze, K., Majewski, P., Hettich, B., and Petzow, G., Z. Metallk. 81, 836–842 (1990).Google Scholar
41McCallum, R.W., Kramer, M.J., Folkerts, T. J., Arrasmith, S. R., Merkle, B. D., Yoo, S. I., Xu, Y., and Dennis, K. W., Oxide Super-conductors, edited by Malik, S.K. and Shah, S.S. (in press).Google Scholar