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Quantifying improvements in adhesion of platinum films on brittle substrates

Published online by Cambridge University Press:  03 March 2011

M.J. Cordill ,
N.R. Moody  and
D.F. Bahr
M.J. Cordill
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
N.R. Moody
Affiliation:
Sandia National Laboratories, Livermore, California 94550-0969
D.F. Bahr
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
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Abstract

This study used nanoindentation coupled with stressed overlayers to evaluate the effect of titanium interlayers on the interfacial fracture energy of platinum films on SiO2 substrates. Interfacial fracture energy was calculated three ways: from platinum buckles that formed spontaneously upon deposition of the film, from buckles that formed upon deposition of a stressed tungsten overlayer, and from blisters triggered by indentation of a platinum film with a tungsten stressed overlayer. The calculated values for the interfacial fracture energy of the Pt-SiO2 interface were 0.2 and 0.5 J/m2 for indentation blisters and spontaneous buckles, respectively. The effect of a titanium interlayer on adhesion was examined using a tungsten stressed overlayer coupled with nanoindentation. The addition of a titanium layer improved the adhesion of the platinum film on SiO2 from 0.2 to 1.0 J/m2.

Keywords

NanoindentationAdhesionThin film
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 6 , June 2004 , pp. 1818 - 1825
Copyright
Copyright © Materials Research Society 2004

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References

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