Hostname: page-component-848d4c4894-sjtt6 Total loading time: 0 Render date: 2024-06-19T06:04:38.014Z Has data issue: false hasContentIssue false

Mechanical properties of compositionally modulated Au-Ni thin films: Nanoindentation and microcantilever deflection experiments

Published online by Cambridge University Press:  03 March 2011

Shefford P. Baker
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
William D. Nix
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
Get access

Abstract

The mechanical properties of compositionally modulated Au-Ni films were investigated by submicrometer depth-sensing indentation and by deflection of micrometer-scale cantilever beams. Films prepared by sputter deposition with composition wavelengths between 0.9 and 4.0 nm were investigated. Strength was found to be high and invariant with composition wavelength. Experimental and data analysis methods were developed to provide more accurate and precise measurements of elastic stiffness. Large enhancements in stiffness (the “supermodulus effect”) were not observed. Rather, relatively small but significant minima were observed at a composition wavelength of about 1.6 nm by both techniques. These variations were found to be strongly correlated with variations in the average lattice parameter normal to the plane of the film. Both structural and mechanical property variations are consistent with a simple model in which the film consists of bulk-like Au and Ni layers with interfaces of constant thickness.

Type
Articles
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Koehler, J. S., Phys. Rev. B 2, 547 (1970).CrossRefGoogle Scholar
2Nix, W. D., Metall. Trans. A 20A, 2217 (1989).CrossRefGoogle Scholar
3Schuller, I. K., Fartash, K., and Grimsditch, M., Mater. Res. Bull. XV, 33 (1990).CrossRefGoogle Scholar
4Cammarata, R. C., Schlesinger, T. E., Kim, C., Qadri, S. B., and Edelstein, A. S., Appl. Phys. Lett. 56, 1862 (1990).CrossRefGoogle Scholar
5Yang, W. M. C., Tsakalakos, T., and Hilliard, J. E., J. Appl. Phys. 48, 876 (1977).CrossRefGoogle Scholar
6Testardi, L. R., Willens, R. H., Krause, J. T., McWhan, D.B., and Nakahara, S., J. Appl. Phys. 52, 510 (1981).CrossRefGoogle Scholar
7Hénein, G.E. and Hilliard, J.E., J. Appl. Phys. 54, 728 (1983).CrossRefGoogle Scholar
8Tsakalakos, T. and Hilliard, J. E., J. Appl. Phys. 54, 734 (1983).CrossRefGoogle Scholar
9Baral, D., Ketterson, J. B., and Hilliard, J. E., J. Appl. Phys. 57, 1076 (1985).CrossRefGoogle Scholar
10Jankowski, A. and Tsakalakos, T., J. Appl. Phys. 57, 1835 (1985).CrossRefGoogle Scholar
11Baker, S. P., Ph.D. Dissertation, Stanford University (1993).Google Scholar
12Itozaki, H., Ph.D. Dissertation, Northwestern University (1982).Google Scholar
13Kueny, A., Grimsditch, M., Miyano, K., Banerjee, I., Falco, CM., and Schuller, I. K., Phys. Rev. Lett. 48, 166 (1982).CrossRefGoogle Scholar
14Danner, R., Huebener, R. P., Chun, C. S. L., Grimsditch, M., and Schuller, I. K., Phys. Rev. B 33, 3696 (1986).CrossRefGoogle Scholar
15Baumgart, P., Hillebrands, B., Mock, R., Giintherodt, G., Boufelfel, A., and Falco, CM., Phys. Rev. B 34, 9004 (1986).CrossRefGoogle Scholar
16Bisanti, P., Brodsky, M. B., Felcher, G. P., Grimsditch, M., and Sill, L. R., Phys. Rev. B 35, 7813 (1987).CrossRefGoogle Scholar
17Dutcher, J. R., Lee, S., Kim, J., Stegeman, G. I., and Falco, CM., Phys. Rev. Lett. 65, 1231 (1990).CrossRefGoogle Scholar
18Davis, B. M., Seidman, D. N., Moreau, A., Ketterson, J. B., Mattson, J., and Grimsditch, M., Phys. Rev. B 43, 9304 (1991).CrossRefGoogle Scholar
19Fartash, A., Fullerton, E. E., Schuller, I. K., Bobbin, S. E., Wagner, J. W., Cammarata, R. C., Kumar, S., and Grimsditch, M., Phys. Rev. B 44, 13760 (1991).CrossRefGoogle Scholar
20Carlotti, G., Fioretto, D., Socino, G., Rodmaq, B., and Pelosin, V., J. Appl. Phys. 71, 4897 (1992).CrossRefGoogle Scholar
21Clemens, B. M. and Eesley, G. L., Phys. Rev. Lett. 61, 2356 (1988).CrossRefGoogle Scholar
22Moreau, A., Ketterson, J. B., and Davis, B., J. Appl. Phys. 68, 1622 (1990).CrossRefGoogle Scholar
23Richardson, G., Makous, J. L., Yu, H. Y., and Edelstein, A. S., Phys. Rev. B 45, 12114 (1992).CrossRefGoogle Scholar
24Berry, B. S. and Pritchet, W. C., Thin Solid Films 33, 19 (1976).CrossRefGoogle Scholar
25Awano, H., Taniguchi, O., Katayama, T., Inoue, F., Itoh, A., and Kawanishi, K., J. Appl. Phys. 64, 6107 (1988).CrossRefGoogle Scholar
26Pelosin, V., Rodmaq, B., Hillairet, J., Carlotti, G., Fioretto, D., and Socino, G., Mater. Sci. Forum 119–121, 359 (1993).CrossRefGoogle Scholar
27Schuller, I. K. and Grimsditch, M., J. Vac. Sci. Technol. B 4, 1444 (1986).CrossRefGoogle Scholar
28Baker, S. P. and Nix, W. D., J. Mater. Res. 9, 3140 (1994).Google Scholar
29Jankowski, A. F., Superlat. Microstruct. 6, 427 (1989).CrossRefGoogle Scholar
30Nutt, S. R., Green, K. A., Baker, S. P., Nix, W. D., and Jankowski, A., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 129.Google Scholar
31Baker, S. P., Jankowski, A. F., Hong, S., and Nix, W. D., in Thin Films: Stresses and Mechanical Properties II, edited by Doerner, M. F., Oliver, W. C., Pharr, G. M., and Brotzen, F. R. (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), p. 289.Google Scholar
32Jankowski, A. F., J. Appl. Phys. 71, 1782 (1992).CrossRefGoogle Scholar
33Wall, M. A. and Jankowski, A. F., Thin Solid Films 181, 313 (1989).CrossRefGoogle Scholar
34Nano Instruments Inc., “Nanoindenter,” Knoxville, TN.Google Scholar
35Doerner, M. F. and Nix, W. D., J. Mater. Res. 1, 601 (1986).CrossRefGoogle Scholar
36Oliver, W. C. and Pharr, G. M., J. Mater. Res. 7, 1564 (1992).CrossRefGoogle Scholar
37Lebouvier, D., Gilormini, P., and Felder, E., J. Phys. D: Appl. Phys. 18, 199 (1985).CrossRefGoogle Scholar
38Laursen, T. A. and Simo, J. C., J. Mater. Res. 7, 618 (1992).CrossRefGoogle Scholar
39Nano Instruments Inc., “Nanoindenter operation and analysis software,” Knoxville, TN.Google Scholar
40Field, J. E., in The Properties of Diamond (Academic Press, London, 1979).Google Scholar
41Weihs, T. P., Hong, S., Bravman, J. C., and Nix, W. D., J. Mater. Res. 3, 931 (1988).CrossRefGoogle Scholar
42Hong, S., Weihs, T. P., Bravman, J. C., and Nix, W. D., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 93.Google Scholar
43Simmons, G. and Wang, H., Single Crystal Elastic Constants and Calculated Aggregate Properties: A Handbook (M.I.T. Press, Cambridge, MA, 1971).Google Scholar
44Timoshenko, S. and Goodier, J. N., Theory of Elasticity (McGraw-Hill, New York, 1970).Google Scholar
45Tabor, D., The Hardness of Metals (Oxford University Press, London, 1951).Google Scholar
46Feldman, C., Orway, F., and Bernstein, J., J. Vac. Sci. Technol. A 8, 117 (1990).CrossRefGoogle Scholar
47Venkatraman, R. and Bravman, J. C., J. Mater. Res. 7, 2040 (1992).CrossRefGoogle Scholar
48Pethica, J. B. and Oliver, W. C., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 13.Google Scholar
49Baker, S. P., in Thin Films: Stresses and Mechanical Properties TV, edited by Townsend, P. H., Weihs, T. P., Sanchez, J. E. Jr., and Børgesen, P. (Mater. Res. Soc. Symp. Proc. 308, Pittsburgh, PA, 1993).Google Scholar
50Vlassak, J. J. and Nix, W. D., Philos. Mag. A 67, 1045 (1993).CrossRefGoogle Scholar
51Carlotti, G., Fioretto, D., Palmieri, L., Socino, G., Verdini, L., Xia, H., Hu, A., and Zhang, X. K., Phys. Rev. B 46, 12777 (1992).CrossRefGoogle Scholar
52Xia, H., Zhang, X. K., Hu, A., Jiang, S. S., Peng, R. W., Zhang, W., Feng, D., Carlotti, G., Fioretto, D., Socino, G., and Verdini, L., Phys. Rev. B 47, 3890 (1993).CrossRefGoogle Scholar