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Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer

Published online by Cambridge University Press:  16 May 2011

Hai P. Nguyen ,
Jiale Su ,
Ziyang Wang ,
Ruud J.M. Vullers ,
Philippe M. Vereecken  and
Jan Fransaer
Hai P. Nguyen
Affiliation:
Department of Metallurgy and Materials Engineering, Katholic University of Leuven, Heverlee 3001, Belgium
Jiale Su
Affiliation:
IMEC/Holst Centre, Eindhoven, 040 4020400, The Netherlands
Ziyang Wang
Affiliation:
IMEC/Holst Centre, Eindhoven, 040 4020400, The Netherlands
Ruud J.M. Vullers
Affiliation:
IMEC/Holst Centre, Eindhoven, 040 4020400, The Netherlands
Philippe M. Vereecken
Affiliation:
IMEC, Heverlee 3001, Belgium; and Center for Surface Chemistry and Catalysis, Katholic University of Leuven, Leuven B-3001, Belgium
Jan Fransaer*
Affiliation:
Department of Metallurgy and Materials Engineering, Katholic University of Leuven, Heverlee 3001, Belgium
*
a)Address all correspondence to this author. e-mail: jan.fransaer@mtm.kuleuven.be
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Abstract

Effect of the seed layer on Seebeck coefficient measurement of electroplated thermoelectric films was quantitatively analyzed. It is found that sheet, rather than bulk resistance of the seed layer, or more precisely its relative comparison to sheet resistance of the film, determines the effects. The analysis reveals that the seed layer’s effect can be neglected (within 1% error) only if the sheet resistance ratio [R□2(film)/R□1(seed)] is smaller than 0.01. This condition commonly requires film thicknesses of 100 μm or more, which is not practically relevant. Based on the analysis we proposed a new method that is applicable for 10 times thinner films. This approach for determining Seebeck coefficient is simple, and more importantly, electroplated films can be characterized in their statu nascendi. Finite element simulation and experiments verified the analysis.

Keywords

ThermoelectricElectrodepositionThermally stimulated current
Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 15: Focus Issue: Advances in Thermoelectric Materials , 14 August 2011 , pp. 1953 - 1957
Copyright
Copyright © Materials Research Society 2011

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References

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