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Lead-free solders: Enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys

Published online by Cambridge University Press:  31 January 2011

U. Saeed ,
H. Flandorfer  and
H. Ipser
U. Saeed
Affiliation:
Institute of Inorganic Chemistry/Materials Chemistry, University of Vienna, A-1090 Wien, Austria
H. Flandorfer*
Affiliation:
Institute of Inorganic Chemistry/Materials Chemistry, University of Vienna, A-1090 Wien, Austria
H. Ipser
Affiliation:
Institute of Inorganic Chemistry/Materials Chemistry, University of Vienna, A-1090 Wien, Austria
*
a)Address all correspondence to this author. e-mail: hans.flandorfer@univie.ac.at
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Abstract

Partial and integral enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys were determined at 1000 °C by a drop calorimetric technique using a Calvet type microcalorimeter. They were obtained by adding Ni to the ternary Ag–Cu–Sn alloys with different composition. The data were evaluated by means of an extended Redlich–Kister–Muggianu polynomial fit for substitutional solutions. The minimum and maximum in the quaternary system were also calculated. It was found that the maximum integral enthalpy of mixing (13,310 J/mol at 41 at.% Ag) occurs in the binary Ag–Ni system while the minimum integral enthalpy of mixing (−21,390 J/mol at 61 at.% Ni) occurs in the binary Ni–Sn system. Moreover the experimental data were compared to values calculated by different extrapolation models based on binary data.

Keywords

CalorimetrySolderingLiquid
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 11 , November 2007 , pp. 3218 - 3225
Copyright
Copyright © Materials Research Society 2007

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References

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