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Influences of brush plating solutions composition and technological parameters on the quality of rolled copper foil surface coatings

Published online by Cambridge University Press:  15 December 2015

Wenjing Wang  and
Xuefeng Liu
Wenjing Wang
Affiliation:
Laboratory of Advanced Processing Technology of Materials (LAPTM), School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China
Xuefeng Liu*
Affiliation:
Laboratory of Advanced Processing Technology of Materials (LAPTM), School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China; and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, People's Republic of China
*
a) Address all correspondence to this author. e-mail: liuxuefengbj@163.com
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Abstract

The technologies of brush plating and dealloying were used to treat the surface of rolled copper foil. Zn–Ni and Sn–Zn alloy coatings were prepared. The laws of plating solutions composition and technological parameters on coatings quality were investigated. The results show that with the decreasing of main elements mass ratio or increasing of brush time, thickness and corrosion resistance of Zn–Ni alloy coating increase. With the increasing of brush plating voltage or time, surface roughness of Sn–Zn alloy coating decreases. Turning up brush plating voltage could raise deposition rate of sub-tin and zinc ions and refine surface grains of coating. The angle of dealloying has the significant effect on the roughness of dealloyed Sn–Zn alloy coating. As the dealloying angle increases, surface roughness of dealloyed Sn–Zn alloy coating increases. The contribution of dealloying time to surface roughness of treated coating is obviously larger than that of corrosion solution concentration.

Keywords

coatingcorrosionelectrodeposition
Type
Articles
Information
Journal of Materials Research , Volume 30 , Issue 24 , 28 December 2015 , pp. 3766 - 3775
Copyright
Copyright © Materials Research Society 2015 

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Footnotes

Contributing Editor: Jürgen Eckert

References

REFERENCES

Menezes, M., Robertson, I.M., and Birnbaum, H.K.: Measurement and improvement of the adhesion of copper to polyimide. J. Mater. Res. 14, 4025–4034 (1999).CrossRefGoogle Scholar
Coombs, C.F.: Printed Circuits Handbook, 6th ed. (The McGraw-Hill Companies, New York, 2008); pp. 8.1-9.17.Google Scholar
Sun, B.K. and O'Keefe, T.J.: Growth of electrolytic copper dendrites and their adhesion to an epoxy resin. Surf. Coat. Technol. 106, 44–52 (1998).Google Scholar
Lee, C.Y., Lee, J.H., Choi, D.H., Lee, H.J., Kim, H.S., Jung, S.B., and Moon, W.C.: Effects of nodule treatment of rolled copper on the mechanical properties of the flexible copper-clad laminate. Microelectron. Eng. 84, 2653–2657 (2007).CrossRefGoogle Scholar
Uehara, K. and Sakurai, M.: Bonding strength of adhesives and surface roughness of joined parts. J. Mater. Process. Technol. 127, 178–181 (2002).Google Scholar
Şekercı́oǧlua, T., Rendeb, H., Gülsöza, A., and Meran, C.: The effects of surface roughness on the strength of adhesively bonded cylindrical components. J. Mater. Process. Technol. 142, 82–86 (2003).Google Scholar
Hino, E., Yamanishi, K., and Sakaguchi, K.: Surface treatment method of a copper foil for printed circuits. U.S. Patent No. 5456817, October 10, 1995.Google Scholar
Jiang, Y.F., Liu, L.F., Zhai, C.Q., Zhu, Y.P., and Ding, W.J.: Corrosion behavior of pulse-plated Zn-Ni alloy coatings on AZ91 magnesium alloy in alkaline solutions. Thin Solid Films 484, 232–237 (2005).CrossRefGoogle Scholar
Müller, C., Sarret, M., and Benballa, M.: Some peculiarities in the code position of zinc-nickel alloys. Electrochim. Acta 46, 2811–2817 (2001).Google Scholar
Byk, T.V., Gaevskaya, T.V., and Tsybulskaya, L.S.: Effect of electrodeposition conditions on the composition, microstructure, and corrosion resistance of Zn-Ni alloy coatings. Surf. Coat. Technol. 202, 5817–5823 (2008).Google Scholar
Yang, H.Y., Guo, X.W., Chen, X.B., Wang, S.H., Wu, G.H., Ding, W.J., and Birbilis, N.: On the electrodeposition of nickel-zinc alloys from a eutectic-based ionic liquid. Electrochim. Acta 63, 131–138 (2012).CrossRefGoogle Scholar
Yamaguchi, H.: Development of non-adhesive type flexible copper clad laminate. J. Photopolym. Sci. Technol. 16, 233–236 (2003).Google Scholar
Wu, B., Xu, B.S., Zhang, B., Jing, X.D., and Liu, C.L.: Automatic brush plating: An update on brush plating. Mater. Lett. 60, 1673–1677 (2006).CrossRefGoogle Scholar
Li, X., Wang, X., Gao, R., and Sun, L.: Study of deposition patterns of plating layers in SiC/Cu composites by electro-brush plating. Appl. Surf. Sci. 257, 10294–10299 (2011).Google Scholar
Yang, R.P., Cai, X., and Chen, Q.L.: Mechanism of hydrogen desorption during palladium brush-plating. Surf. Coat. Technol. 141, 283–285 (2001).Google Scholar
Huang, L., Wei, H.B., Ke, F.S., Fan, X.Y., Li, J.T., and Sun, S.G.: Electrodeposition and lithium storage performance of three-dimensional porous reticular Sn-Ni alloy electrodes. Electrochim. Acta 54, 2693–2698 (2009).CrossRefGoogle Scholar
Erlebacher, J., Aziz, M.J., Karma, A., Dimitrov, N., and Sieradaki, K.: Evolution of nanoporosity in dealloying. Nature 410, 450–453 (2001).Google Scholar
Liu, W.B., Zhang, S.C., Li, N., Zheng, J.W., An, S.S., and Xing, Y.L.: A general dealloying strategy to nanoporous intermetallics, nanoporous metals with bimodal, and unimodal pore size distributions. Corros. Sci. 58, 133–138 (2012).Google Scholar
Wang, W.J., Liu, X.F., and Xie, J.X.: Double-coating and porous treatments and evaluation of rolled copper foil surface. Surf. Coat. Technol. 254, 284–290 (2014).Google Scholar
Liu, X.F., Wang, W.J., and Xie, J.X.: A surface-treated copper foil and preparation method. CN103501580 A, October 9, 2013.Google Scholar
Chang, J.K., Hsu, S.H., Sun, I.W., and Tsai, W.T.: Formation of nanoporous nickel by selective anodic etching of the nobler copper component from electrodeposited nickel-copper alloys. J. Phys. Chem. 112, 1371–1376 (2008).Google Scholar