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Indentation load relaxation experiments with indentation depth in the submicron range

Published online by Cambridge University Press:  31 January 2011

W. R. LaFontaine
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
B. Yost
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
R. D. Black
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
C-Y. Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
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Abstract

Indentation load relaxation (ILR) experiments with indentation depths in the submicron range are described. Under appropriate conditions, the ILR data are found to yield flow curves of the same shape as those based on conventional load relaxation data. Variations in flow properties as a function of depth in submicron metal films deposited on a hard substrate are detected by the experiments described.

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Articles
Copyright
Copyright © Materials Research Society 1990

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References

REFERENCES

1Gupta, I. and Li, J. C. M., Metall. Trans. 1, 23232330 (1970).Google Scholar
2Hart, E. W. and Solomon, H. D., Acta Metall. 21, 195200 (1973).Google Scholar
3Hart, E. W., J. Engr. Mat. and Tech. 98, 193201 (1976).Google Scholar
4Hart, E. W., Li, C-Y., Yamada, H., and Wire, G. L., in Constitutive Equations in Plasticity, edited by Argon, A. S. (MIT Press, Cambridge, MA, 1975), pp. 149197.Google Scholar
5 “Collection and Uses for Relaxation Data in Design”, 1989 ASME Pressure Vessels and Piping Conference, edited by R. W. Swinderman, Y. Asada, and J. T. Fong (1989).Google Scholar
6 “Stress Relaxation Testing”, ASTM STP 676 (1978).Google Scholar
7Doerner, M. F. and Nix, W. D., J. Mater. Res. 1, 601609 (1986).Google Scholar
8Stone, D., LaFontaine, W. R., Alexopoulos, P. S., Wu, T-W., and Li, Che-Yu, Mater, J.. Res. 3, 141147 (1988).Google Scholar
9Doerner, M. F., Gardner, D. S., and Nix, W. D., J. Mater. Res. 1, 845851 (1986).Google Scholar
10Flinn, P. A., Gardner, D. S., and Nix, W. D., IEEE Trans, on Electron Devices, ED-34, 689699 (1987).Google Scholar
11Korhonen, M. A. and Paszkiet, C. A., Scripta Metall. 23, 14491454 (1989).Google Scholar
12Hannula, S-P., Stone, D., and Li, C-Y., in Electronic Packaging Materials Science, edited by Giess, E. A., Tu, K-N., and Uhlmann, D. R. (Mater. Res. Soc. Symp. Proc. 40, Pittsburgh, PA, 1985), pp. 217224.Google Scholar
13Li, Che-Yu, Black, R. D., and LaFontaine, W. R., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), pp. 225229.Google Scholar
14Korhonen, M. A., Hannula, S-P., and Li, C-Y., in Unified Constitutive Equations in Plastic Deformation and Creep of Engineering Alloys, edited by Miller, A. K. (Applied Science Publishers Ltd., Essex, England, 1987), pp. 89137.Google Scholar
15Hannula, S-P., Wanagel, J., and Li, C-Y., “A Comparison Study of The Mechanical Properties of Bonding Wire,” ASTM STP 850, edited by Gupta, D. C., ASTM, 485499 (1984).Google Scholar
16Alexopoulos, P. S., Keusseyan, R. L., Wire, G. L., and Li, C-Y., in Mechanical Testing for Deformation Model Development, edited by Rohde, R. W. and Swearengen, J. C., ASTM Spec. Tech. Publ. 765, pp. 148155 (1982).CrossRefGoogle Scholar
17Black, R. D., LaFontaine, W. R., and Li, Che-Yu, submitted for publication, Thin Solid Films, 1990.Google Scholar
18LaFontaine, W. R., Yost, B., and Li, Che-Yu, J. Mater. Res. 5, 776 (1990).Google Scholar