- Cited by 108
Suganuma, Katsuaki 2001. Advances in lead-free electronics soldering. Current Opinion in Solid State and Materials Science, Vol. 5, Issue. 1, p. 55.
Shohji, Ikuo Nakamura, Takao Mori, Fuminari and Fujiuchi, Shinichi 2002. Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints. MATERIALS TRANSACTIONS, Vol. 43, Issue. 8, p. 1797.
Bae, Kyoo-Sik and Kim, Si-Jung 2002. Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints. Journal of Materials Research, Vol. 17, Issue. 04, p. 743.
Chen, Kang-I. and Lin, Kwang-Lung 2002. The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—the effect of Ag. Journal of Electronic Materials, Vol. 31, Issue. 8, p. 861.
Wu, C. M. L. Yu, D. Q. Law, C. M. T. and Wang, L. 2002. The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements. Journal of Electronic Materials, Vol. 31, Issue. 9, p. 921.
Kang-I Chen and Kwang-Lung Lin 2002. Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys. p. 49.
Wu, C. M. L. Yu, D. Q. Law, C. M. T. and Wang, L. 2002. Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn–Ag alloy by doping with rare-earth elements. Journal of Materials Research, Vol. 17, Issue. 12, p. 3146.
Chen, Kang-I and Lin, Kwang-Lung 2003. The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—The effect of Ga. Journal of Electronic Materials, Vol. 32, Issue. 10, p. 1111.
Iwanishi, H. Hirose, A. Imamura, T. Tateyama, K. Mori, I. and Kobayashi, K. F. 2003. Properties of quad flat package joints using Sn-Zn-Bi solder with varying lead-plating materials. Journal of Electronic Materials, Vol. 32, Issue. 12, p. 1540.
Kwang-Lung Lin Kang-I Chen Hui-Min Hsu and Chia-Ling Shi 2003. Improvement in the properties of Sn-Zn Eutectic based Pb-free solder. p. 658.
Lin, Kwang-Lung Chen, Kang-I and Shi, Po-Cheng 2003. A potential drop-in replacement for eutectic Sn-Pb solder—The Sn-Zn-Ag-Al-Ga solder. Journal of Electronic Materials, Vol. 32, Issue. 12, p. 1490.
Nimmo, Kay 2003. Lead-Free Soldering in Electronics.
Wu, C. M. L. Law, C. M. T. Yu, D. Q. and Wang, L. 2003. The wettability and microstructure of Sn-Zn-RE alloys. Journal of Electronic Materials, Vol. 32, Issue. 2, p. 63.
Cheng, Shou Chang and Lin, Kwang Lung 2003. Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C. Journal of Materials Research, Vol. 18, Issue. 08, p. 1795.
Huang, Chia-Wei and Lin, Kwang-Lung 2004. Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C. Journal of Materials Research, Vol. 19, Issue. 12, p. 3560.
Duan, L.L. Yu, D.Q. Han, S.Q. Ma, H.T. and Wang, L. 2004. Microstructural evolution of Sn–9Zn–3Bi solder/Cu joint during long-term aging at 170°C. Journal of Alloys and Compounds, Vol. 381, Issue. 1-2, p. 202.
Chuang, Chiang-Ming Hung, Hui-Tzu Liu, Pei-Chi and Lin, Kwang-Lung 2004. The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates. Journal of Electronic Materials, Vol. 33, Issue. 1, p. 7.
Chang, Tao-Chih Hon, Min-Hsiung and Wang, Moo-Chin 2004. Morphology and Phase Transformation at a Solder Joint in a Solid-State Reaction. Electrochemical and Solid-State Letters, Vol. 7, Issue. 2, p. J4.
Date, M. Tu, K.N. Shoji, T. Fujiyoshi, M. and Sato, K. 2004. Interfacial reactions and impact reliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads. Journal of Materials Research, Vol. 19, Issue. 10, p. 2887.
Chang, Tao-Chih Wang, Moo-Chin and Hon, Min-Hsiung 2004. Morphology and adhesion strength of the Sn–9Zn–3.5Ag/Cu interface after aging. Journal of Crystal Growth, Vol. 263, Issue. 1-4, p. 223.
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The potential of the newly developed Sn–9Zn solder paste as a lead-free solder, especially focusing on the stability at high temperature, was examined. The initial interface strength between Sn–9Zn and Cu, about 50 MPa by the tensile test, is higher than other interfaces such as Sn–37Pb/Cu. While the Sn–9Zn/Cu interface maintains the high strength level after heat exposure at 125 °C, the heat exposure at 150 °C degrades strength seriously. The degradation at 150 °C is caused by dissipation and by disruption of the Cu–Zn reaction layer at the interface. Where the Cu–Zn layer is eroded to form a whole, Sn directly reacts with a Cu substrate to form a thick Sn–Cu reaction region. Such an interfacial morphology change causes the serious degradation. With the Ni/Pd/Au coating on a Cu substrate, the interface becomes much stronger than the direct interface. Even after heat exposure at 150 °C, strength degradation is not so significant. Zn segregates into the coating layer. During high-temperature exposure, Ni and Pd diffuse each other. Zn also diffuses into the coating layer to form compounds, and as a result, a depleted zone of Zn is formed in the solder close to the interface.
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- ISSN: 0884-2914
- EISSN: 2044-5326
- URL: /core/journals/journal-of-materials-research
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