- Cited by 23
Sundelin, Janne J. Nurmi, Sami T. Lepistö, Toivo K. and Ristolainen, Eero O. 2005. Effect of PCB surface finish on creep properties of lead‐free solder joints. Soldering & Surface Mount Technology, Vol. 17, Issue. 4, p. 3.
Chang, C. W. Ho, C. E. Yang, S. C. and Kao, C. R. 2006. Kinetics of AuSn4 migration in lead-free solders. Journal of Electronic Materials, Vol. 35, Issue. 11, p. 1948.
Cho, Moon Gi Paik, Kyung Wook Lee, Hyuck Mo Booh, Seong Woon and Kim, Tae-Gyu 2006. Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging. Journal of Electronic Materials, Vol. 35, Issue. 1, p. 35.
Dezhi Li Changqing Liu and Conway, P.P. 2006. Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads. p. 108.
Sundelin, Janne J. Nurmi, Sami T. Lepistö, Toivo K. and Ristolainen, Eero O. 2006. Mechanical and microstructural properties of SnAgCu solder joints. Materials Science and Engineering: A, Vol. 420, Issue. 1-2, p. 55.
Yoon, Jeong-Won Lim, Jun Hyung Lee, Hoo-Jeong Joo, Jinho Jung, Seung-Boo and Moon, Won-Chul 2006. Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C. Journal of Materials Research, Vol. 21, Issue. 12, p. 3196.
Yoon, Jeong-Won Chun, Hyun-Suk and Jung, Seung-Boo 2007. Reliability analysis of Au–Sn flip-chip solder bump fabricated by co-electroplating. Journal of Materials Research, Vol. 22, Issue. 05, p. 1219.
Yoon, Jeong-Won and Jung, Seung-Boo 2007. Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging. Materials Science and Engineering: A, Vol. 452-453, Issue. , p. 46.
Yoon, Jeong-Won Chun, Hyun-Suk Koo, Ja-Myeong and Jung, Seung-Boo 2007. Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications. Microsystem Technologies, Vol. 13, Issue. 11-12, p. 1463.
Jang, J.W. Lin, J.K. Frear, D.R. Lee, T.Y. and Tu, K.N. 2007. Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging. Journal of Materials Research, Vol. 22, Issue. 04, p. 826.
Li, Dezhi Liu, Changqing and Conway, Paul P. 2008. Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB. Journal of Electronic Packaging, Vol. 130, Issue. 1, p. 011005.
Yoon, Jeong-Won and Jung, Seung-Boo 2008. Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn–3.5Ag–0.7Cu solder joint. Journal of Alloys and Compounds, Vol. 458, Issue. 1-2, p. 200.
Kim, J.S. Wang, P.J. and Lee, C.C. 2008. Fluxless Hermetic Lid Sealing Using Electroplated Sn-Rich Solder. IEEE Transactions on Components and Packaging Technologies, Vol. 31, Issue. 3, p. 719.
Yoon, Jeong-Won Noh, Bo-In Lee, Young-Ho Lee, Hyo-Soo and Jung, Seung-Boo 2008. Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint. Microelectronics Reliability, Vol. 48, Issue. 11-12, p. 1864.
Chung, Bo-Mook Hong, Kyoung-Kook and Huh, Joo-Youl 2009. Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1−xNix)6Sn5 layer on a Ni substrate. Metals and Materials International, Vol. 15, Issue. 3, p. 487.
Yoon, J.-W. and Jung, S.-B. 2009. Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint. Materials Science and Technology, Vol. 25, Issue. 12, p. 1478.
Wang, Xinxin Ma, Limin Qi, Ya Liu, Jianping Guo, Fu and Liu, Li 2012. Impact of Sn3.0Ag0.5Cu solder powder size on the reliability of solder joints in high density led packages. p. 1416.
Wei, Xiao-feng Zhang, Yu-kun Wang, Ri-chu and Feng, Yan 2013. Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints. Microelectronics Reliability, Vol. 53, Issue. 5, p. 748.
Chee, Sang-Soo and Lee, Jong-Hyun 2014. Fabrication of Cu-Ni mixed phase layer using DC electroplating and suppression of Kirkendall voids in Sn-Ag-Cu solder joints. Electronic Materials Letters, Vol. 10, Issue. 3, p. 637.
Zhu, Xuewei Wang, Richu Peng, Chaoqun Wei, Xiaofeng and Peng, Jian 2014. Reactions and mechanical properties between AuSn20 solders and metalized Al–Si alloys for electronic packaging application. Journal of Materials Science: Materials in Electronics, Vol. 25, Issue. 2, p. 742.
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The evolution of an interfacial microstructure between Cu/Ni/Au bond-pad metallization and Pb-free or Pb-containing solder bumps during solid-state aging was investigated. A distinctive difference between the Pb-containing and Pb-free solder bumps was observed. A continuous (Au,Ni)Sn4 intermetallic compound layer was readily detected in the Pb-containing solder bump on the bond-pad. No such layer exists in the Pb-free case; instead a large number of (Au,Ni)Sn4 particles scatter in the bulk of the solder. The different morphologies of the (Au,Ni)Sn4 have been explained on the basis of the contact angle in Young's equation and of the growth of a flat layer by ripening. A simple kinetic analysis of ripening between a set of monosize spheres and a flat surface is given to describe the layered growth having a time dependence around 0.5.
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- ISSN: 0884-2914
- EISSN: 2044-5326
- URL: /core/journals/journal-of-materials-research
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