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Effects of B and Y additions on the microstructure and properties of Cu–Mg–Te alloys

Published online by Cambridge University Press:  09 October 2013

Xingguo Zhang ,
Jianning Han ,
Liang Chen ,
Bingwen Zhou ,
Yanyan Xue  and
Fei Jia
Xingguo Zhang*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People's Republic of China
Jianning Han
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People's Republic of China
Liang Chen
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People's Republic of China
Bingwen Zhou
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People's Republic of China
Yanyan Xue
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People's Republic of China
Fei Jia
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People's Republic of China
*
a)Address all correspondence to this author. e-mail: zxgwj@dlut.edu.cn
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Abstract

Compound effects of B and Y additions on the microstructures and properties of a new type of high-strength and high-conductivity (HSHC) Cu–Mg–Te alloys are investigated on the aspects of purification and precipitation. Because of the purification function of B and Y additions, the tensile strength increased superlatively by the amplitude of 21.7% with a similar increase of elongation and the electrical conductivity of 4.2%. By comparison of the calculated decomposition pressures of B2O3 and Y2O3 at different temperatures, it can be concluded that the boron oxide is more stable than the yttrium oxide in the copper liquid, indicating the superior deoxygenization purification of the rare earth yttrium. The dispersive distribution of the Y–B compounds (YB6) was another factor for the improvement of the mechanical properties of the copper alloy. Finally, the copper alloy treated by hot rolling, cold rolling, and annealing processes in sequence exhibits HSHC with the tensile strength of 610.7 MPa and the electrical conductivity of 53.1%IACS.

Type
Articles
Information
Journal of Materials Research , Volume 28 , Issue 19 , 14 October 2013 , pp. 2747 - 2752
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Li, M., Heuer, J.K., Stubbins, J.F., and Edwards, D.J.: Fracture behavior of high-strength, high-conductivity copper alloys. J. Nucl. Mater. 283–287, 977 (2000).CrossRefGoogle Scholar
Liu, R., Tao, H., Zhou, X., Lu, D., Liu, K., Peng, Q., Peng, Y., and Zhong, F.: Present situation and future prospect of high-strength and high-conductivity Cu alloy. Mater. Rev. 26(10), 100 (2012).Google Scholar
Azevedo, C.R.F. and Sinatora, A.: Failure analysis of a railway copper contact strip. Eng. Fail. Anal. 11, 829 (2004).CrossRefGoogle Scholar
Zhang, Q. and Song, W.: The research and development of copper and copper alloy contact wires and messenger wires. Modern Urban Transit 2, 18 (2004).Google Scholar
Zhao, Y., Liu, P., Liu, X., Chen, X., Ma, F., Li, W., and He, D.: Research Progress and application of contact wire for high-speed electric railway. Mater. Rev. 26(3), 46 (2012).Google Scholar
Shen, Y., Fu, Z., Zhang, G., Kong, J., Zhang, J., Liu, M., Hu, J., Wang, S., and Xie, M.: Researching prospect and developing tendency on high-strength and high-conductivity copper-silver alloys. Mater. Rev. 26(13), 109 (2012).Google Scholar
Zilly, A., Christian, U., Kött, S., Nobiling, D., and Jost, N.: Production and metallographic examination of precipitable Cu-Mg alloys. Pract. Metallogr. 48(11), 582 (2011).CrossRefGoogle Scholar
Wu, C.: Copper-Magnesium alloy contact wire with high strength. J. Railway Eng. Soc. 13(4), 99 (1996).Google Scholar
Sağlam, I., Özyürek, D., and Çetinkaya, K.: Effect of ageing treatment on wear properties and electrical conductivity of Cu-Cr-Zr alloy. Bull. Mater. Sci. 34(7), 1465 (2011).CrossRefGoogle Scholar
Lu, D., Wang, J., Zeng, W., Liu, Y., Lu, L., and Sun, B.: Study on high-strength and high-conductivity Cu–Fe–P alloy. Mater. Sci. Eng., A 421(1–2), 254 (2006).CrossRefGoogle Scholar
Monzen, R. and Watanabe, C.: Microstructure and mechanical properties of Cu-Ni-Si alloys. Mater. Sci. Eng., A 483–484(15), 117 (2008).CrossRefGoogle Scholar
Ruan, W. and Xie, G.: Introduction to independent innovation of China's high-speed rail contact line technology. China Invention & Patent 8, 48 (2011).Google Scholar
Maki, K., Ito, Y., Matsumaga, H., and Mori, H.: Solid-solution copper alloys with high strength and high electrical conductivity. Scr. Mater. 68(10), 777 (2013).CrossRefGoogle Scholar
Louadi, S., Yassin, A., Bros, H., and Castanet, R.: Thermodynamic investigation of the Ag-Te and Cu-Te eutectic alloys. J. Alloys Compd. 224, 351 (1995).CrossRefGoogle Scholar
Li, H., Xie, S., Zhu, X., Liu, Y., Wu, P., and Cheng, L.: Influence of cerium and yttrium on Cu-Cr-Zr alloys. J. Rare Earths 24, 367 (2006).Google Scholar
Lu, D., Wang, J., Lu, L., Liu, Y., Xie, S., and Sun, B.: Effect of B and Ce on microstructures and properties of Cu-Fe-P alloy. J. Chin. Rare Earth Soc. 24(4), 475 (2006).Google Scholar
Zhuo, Z., Ni, H., and Sun, B.: The contrast of refining effects on copper by rare earth and boron. Foundry 51(7), 435 (2002).Google Scholar
Zhou, S., Zhao, B., Zhao, Z., and Jin, X.: Application of lanthanum in high strength and high conductivity copper alloys. J. Rare Earths 24, 385 (2006).Google Scholar
Ellis, T.W., Anderson, I.E., Downing, H.L., and Verhoeven, J.D.: Deformation-processed wire prepared from gas-atomized Cu-Nb alloy powders. Metall. Mater. Trans. A 24(1), 21 (1993).CrossRefGoogle Scholar
Ye, D. and Hu, J.: Practical Inorganic Thermodynamic Data Handbook (Metallurgical Industry Press, Beijing, 2002).Google Scholar
Wang, J., Jiang, X., and Li, S.: Effect of boron on microstructure and properties of copper-based alloys. Chin. J. Mater. Res. 11(4), 381 (1997).Google Scholar