Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Song, Jenn-Ming
Liu, Pei-Chi
Shih, Chia-Ling
and
Lin, Kwang-Lung
2005.
Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering.
Journal of Electronic Materials,
Vol. 34,
Issue. 9,
p.
1249.
Yoon, Jeong-Won
Chun, Hyun-Suk
and
Jung, Seung-Boo
2005.
Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging.
MATERIALS TRANSACTIONS,
Vol. 46,
Issue. 11,
p.
2386.
Yoon, Jeong-Won
and
Jung, Seung-Boo
2006.
Reliability studies of Sn–9Zn/Cu solder joints with aging treatment.
Journal of Alloys and Compounds,
Vol. 407,
Issue. 1-2,
p.
141.
Yu, Chang-Ho
and
Lin, Kwang-Lung
2006.
The atomic-scale studies of the behavior of the crystal dissolution in a molten metal.
Chemical Physics Letters,
Vol. 418,
Issue. 4-6,
p.
433.
Young Kun Jee
Jong Yeon Kim
Jin Yu
and
Taek Yeong Lee
2007.
Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations..
p.
1.
Yoon, Jeong-Won
Chun, Hyun-Suk
and
Jung, Seung-Boo
2007.
Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test.
Journal of Materials Science: Materials in Electronics,
Vol. 18,
Issue. 5,
p.
559.
Jee, Y.K.
Ko, Y.H.
and
Yu, Jin
2007.
Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad.
Journal of Materials Research,
Vol. 22,
Issue. 7,
p.
1879.
Jee, Y. K.
Ko, Y. H.
Yu, Jin
Lee, T. Y.
Cho, M. K.
and
Lee, H. M.
2007.
Comparative Study of Drop Reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn Solders.
p.
957.
Liu, Nai-Shuo
and
Lin, Kwang-Lung
2008.
Evolution of interfacial morphology of Sn–8.5Zn–0.5Ag–0.1Al–xGa/Cu system during isothermal aging.
Journal of Alloys and Compounds,
Vol. 456,
Issue. 1-2,
p.
466.
Lai, R.S.
Lin, K.L.
and
Salam, B.
2008.
Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders.
Soldering & Surface Mount Technology,
Vol. 20,
Issue. 1,
p.
22.
Pan, Chien-Cheng
Yu, Chang-Ho
and
Lin, Kwang-Lung
2008.
The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn–3.0Ag–0.5Cu on a Cu substrate.
Applied Physics Letters,
Vol. 93,
Issue. 6,
Chen, Wenxue
Xue, Songbai
Wang, Hui
Wang, Jianxin
and
Han, Zongjie
2009.
Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate.
Rare Metals,
Vol. 28,
Issue. 6,
p.
656.
Shen, J.
and
Chan, Y.C.
2009.
Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads.
Journal of Alloys and Compounds,
Vol. 477,
Issue. 1-2,
p.
552.
Wang, Kai-Jheng
Lin, Yung-Chi
Duh, Jenq-Gong
Cheng, Ching-Yuan
and
Lee, Jey-Jau
2010.
In situ investigation of the interfacial reaction in Sn/Cu system by synchrotron radiation.
Journal of Materials Research,
Vol. 25,
Issue. 5,
p.
972.
Pan, Chien-Cheng
and
Lin, Kwang-Lung
2011.
The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate.
Journal of Applied Physics,
Vol. 109,
Issue. 10,
Liu, Lijuan
Zhou, Wei
Mu, Wenkai
and
Wu, Ping
2011.
Interfacial Reactions of Sn-3.5Ag-xZn Solders and Cu Substrate During Liquid-State Aging.
Journal of Electronic Materials,
Vol. 40,
Issue. 3,
p.
306.
Mittal, Jagjiwan
and
Lin, Kwang Lung
2012.
Diffusion of Cu and interfacial reactions during reflow of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga alloy on Ni/Cu substrate.
Journal of Materials Research,
Vol. 27,
Issue. 8,
p.
1142.
Lin, Kwang-Lung
Lin, Yu-Wei
and
Yu, Chang-Ho
2012.
The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process.
JOM,
Vol. 64,
Issue. 10,
p.
1184.
Yu, Chi-Yang
and
Duh, Jenq-Gong
2012.
Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging.
Journal of Materials Science,
Vol. 47,
Issue. 17,
p.
6467.
Thankalekshmi, Ratheesh R.
Dixit, Samwad
Bae, In-Tae
VanHart, Daniel
and
Rastogi, A.C.
2012.
Synthesis and Characterization of Cu-doped ZnO Film in Nanowire like Morphology Using Low Temperature Self-Catalytic Vapor-Liquid-Solid (VLS) Method.
MRS Proceedings,
Vol. 1494,
Issue. ,
p.
37.