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Direct writing of electronic and sensor materials using a laser transfer technique

  • A. Piqué (a1), D. B. Chrisey (a1), J. M. Fitz-Gerald (a1), R. A. McGill (a1), R. C. Y. Auyeung (a2), H. D. Wu (a2), S. Lakeou (a3), Viet Nguyen (a4), R. Chung (a4) and M. Duignan (a5)...

Abstract

We present a laser-based direct write technique termed matrix-assisted pulsed-laser evaporation direct write (MAPLE DW). This technique utilizes a laser transparent fused silica disc coated on one side with a composite matrix consisting of the material to be deposited mixed with a laser absorbing polymer. Absorption of laser radiation results in the decomposition of the polymer, which aids in transferring the solute to an acceptor substrate placed parallel to the matrix surface. Using MAPLE DW, complex patterns consisting of metal powders, ceramic powders, and polymer composites were transferred onto the surfaces of various types of substrates with <10 micron resolution at room temperature and at atmospheric pressure without the use of masks.

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Direct writing of electronic and sensor materials using a laser transfer technique

  • A. Piqué (a1), D. B. Chrisey (a1), J. M. Fitz-Gerald (a1), R. A. McGill (a1), R. C. Y. Auyeung (a2), H. D. Wu (a2), S. Lakeou (a3), Viet Nguyen (a4), R. Chung (a4) and M. Duignan (a5)...

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