Hostname: page-component-76fb5796d-45l2p Total loading time: 0 Render date: 2024-04-25T10:00:25.713Z Has data issue: false hasContentIssue false
  • English
  • Français

Dense, bubble-free ceramic deposits from aqueous suspensions by electrophoretic deposition

Published online by Cambridge University Press:  31 January 2011

Tetsuo Uchikoshi ,
Kiyoshi Ozawa ,
Benjamin D. Hatton  and
Yoshio Sakka
Tetsuo Uchikoshi
Affiliation:
National Research Institute for Metals, 1-2-1 Sengen, Tsukuba, Ibaraki 305–0047, Japan
Kiyoshi Ozawa
Affiliation:
National Research Institute for Metals, 1-2-1 Sengen, Tsukuba, Ibaraki 305–0047, Japan
Benjamin D. Hatton
Affiliation:
National Research Institute for Metals, 1-2-1 Sengen, Tsukuba, Ibaraki 305–0047, Japan
Yoshio Sakka
Affiliation:
National Research Institute for Metals, 1-2-1 Sengen, Tsukuba, Ibaraki 305–0047, Japan
Get access

Abstract

The characteristics of electrophoretic deposition (EPD) of positively charged particles onto a cathode were investigated using aqueous alumina and zirconia suspensions. The deposition was performed using several kinds of metal substrates at different current densities. For most substrate materials, a large number of macropores appeared in the deposit, and their size increased with the current density due to gas bubble formation. However, no macropores were formed in the deposit on a palladium substrate, regardless of the current density. The green density and sintering properties of the EPD deposits on a palladium substrate from aqueous suspensions were the same as from slip casting. Bubble-free zirconia/alumina laminate composites were also fabricated by EPD from aqueous suspensions.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 16 , Issue 2 , February 2001 , pp. 321 - 324
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Sarkar, P. and Nicholson, P.S., J. Am. Ceram. Soc. 79, 1987 (1996).CrossRefGoogle Scholar
2.Nicholson, P.S., Sarkar, P., and Datta, S., Am. Ceram. Soc. Bull. 75, 48 (1996).Google Scholar
3.Industrial Electrochemical Processes, edited by Kuhn, A.T. (Elsevier, Amsterdam, The Netherlands, 1971), pp. 128, 129.Google Scholar
4.Ryan, W. and Massoud, E., Interceram. 2, 117 (1979).Google Scholar
5.Ryan, W., Massoud, E., and Perera, C.T.S.B., Trans. Brit. Ceram. Soc. 80, 46 (1981).Google Scholar
6.Clasen, R., in Science, Technology, and Applications of Colloidal Suspensions, edited by Adair, J.H., Casey, J.A., Randle, C.A., and Venigalla, S. (Ceram. Trans. 54, Am. Ceram. Soc., Westerville, OH, 1995), pp. 169, 84.Google Scholar
7.Chronberg, M.S. and Händle, F., Interceram. 1, 33 (1978).Google Scholar
8.Hoffman, H., Am. Ceram. Soc. Bull. 57, 605 (1978).Google Scholar
9.Mihailescu, M., Emandi, M., Vancea, V., and Marcu, M., Interceram. 40, 165 (1991).Google Scholar
10.Ferrari, B., Sänchez-Herencia, A.J., and Monero, R., Mater. Lett. 35, 370 (1998).CrossRefGoogle Scholar