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Structural characterization of deuterated titanium thin films

Published online by Cambridge University Press:  31 January 2011

R. Checchetto  and
P. Scardi
R. Checchetto
Affiliation:
Istituto Nazionale per la Fisica della Material (INFM) and Dipartimento di Fisica, Università di Trento, I-38050 Povo (TN), Italy
P. Scardi
Affiliation:
Dipartimento di Ingegneria dei Materiali, Università di Trento, 1-38050 Mesiano (TN), Italy
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Abstract

Pure and deuterated titanium thin films 140 nm thick were deposited on 〈100〉 Si wafers by electron beam evaporation, keeping the substrate temperature at 150, 300, and 450 °C. Pure Ti samples were deposited in a high-vacuum condition, while for deuterated samples, deuterium high-purity gas was introduced in the deposition chamber during the process. Film composition was studied by Rutherford backscattering spectrometry (RBS) and elastic recoil detection analysis (ERDA), whereas structural characterization of the deposited layers was carried out by x-ray diffraction (XRD) using both the traditional Bragg–Brentano geometry and a parallel beam setup for pole figure measurements. Titanium films deposited in a high vacuum showed the hexagonal Ti structure (α−Ti) and grew with a double orientation at each of the examined substrate temperatures. Deuterated titanium films deposited at 150 °C had a compositional ratio Ti: D = 1: 0.35 and grew with a [111] oriented fcc structure, suggesting the formation at low temperature of a substoichiometric δ hydride phase. Deuterated films deposited at higher substrate temperatures revealed a lower deuterium content and XRD reflections corresponding to the hexagonal Ti phase. The present results were interpreted according to a temperaturedependent D2 adsorption mechanism at the surface of the continuously growing Ti film.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 5 , May 1999 , pp. 1969 - 1976
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1.Kohn, H.D. and Ducheyne, P.J., J. Mater. Sci. 26, 328 (1991).CrossRefGoogle Scholar
2.Maaza, M., Jiang, Z., Samuels, F., Farnoux, B., and Vidal, B., J. Appl. Cryst. 25, 789 (1992).Google Scholar
3.Proc. First Int. Symp. Hydrogen in Metals and Metal Hydrides, edited by Kirchheim, R., Fromm, E., and Wicke, E. (Oldenburg, Munich, Germany, 1988).Google Scholar
4.Lewkowicz, I., Diffusion Defect Data B, Solid State Phenom. 49–50, 239 (1996).Google Scholar
5.Murrey, J. L., Phase Diagrams of Binary Titanium Alloys (ASM, Metals Park, OH).Google Scholar
6.Wedler, G. and Struthenk, H., Z. Phys. Chem. N.F. 48, 86 (1966).CrossRefGoogle Scholar
7.Zhang, C., Kang, Q., Lai, Z., and Ji, R., Acta Mater. 44, 1077 (1996).CrossRefGoogle Scholar
8.Badyal, J. P. S., Gellman, A. J., and Lambert, R. M., J. Catal. 111, 383 (1988).CrossRefGoogle Scholar
9.Kasemo, B. and Tornqvist, E., Appl. Surf. Sci. 3, 307 (1979).CrossRefGoogle Scholar
10.Xiao, Z.L., Hauge, R.H., and Margrave, J.L., J. Phys. Chem. 95, 2696 (1991).CrossRefGoogle Scholar
11.Kirst, T., Brière, M., and Cser, L., Thin Solid Films 228, 141 (1993).CrossRefGoogle Scholar
12.Chatbi, H., Vergnat, M., and Marchal, G., Appl. Phys. Lett. 64, 1210 (1994).CrossRefGoogle Scholar
13.Checchetto, R., Thin Solid Films 302, 77 (1997).CrossRefGoogle Scholar
14.Scardi, P., Setti, S., and Leoni, M., Mater. Sci. Forum (1999), in press.Google Scholar
15.Ziegler, J. F., in Helium: Stopping Power and Ranges in all Element Matter (Pergamon Press, New York, 1997).Google Scholar
16. ICDD-International Centre for Diffraction Data, Newtown Square, PA 19073–3273.Google Scholar
17.Scardi, P., Veneri, S., Leoni, M., Polini, R., and Traversa, E., Thin Solid Films 290–291, 136 (1996).CrossRefGoogle Scholar
18.Harra, D. J., J. Vac. Sci. Technol. 13, 471 (1976).CrossRefGoogle Scholar
19.Leoni, M. and Scardi, P., Mater. Sci. Forum 278–281, 177 (1998).CrossRefGoogle Scholar
20.Noyan, I. C. and Cohen, J. B., Residual Stress (Springer-Verlag, New York), 1987.CrossRefGoogle Scholar