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Electrically conductive CuS–poly(acrylic acid) composite coatings

Published online by Cambridge University Press:  31 January 2011

H. Hu ,
J. Campos  and
P. K. Nair
H. Hu
Affiliation:
Photovoltaic Systems Group, Laboratorio de Energía Solar, IIM, Universidad Nacional Autonoma de Mexico, Temixco 62580, Morelos, México
J. Campos
Affiliation:
Photovoltaic Systems Group, Laboratorio de Energía Solar, IIM, Universidad Nacional Autonoma de Mexico, Temixco 62580, Morelos, México
P. K. Nair
Affiliation:
Photovoltaic Systems Group, Laboratorio de Energía Solar, IIM, Universidad Nacional Autonoma de Mexico, Temixco 62580, Morelos, México
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Abstract

Copper sulfide (CuS) powder precipitated from a chemical bath containing Cu(II) chloride and thiourea and annealed in air at 150 °C for 1 h was dispersed in a poly(acrylic acid) aqueous solution (with additional water or propylene glycol as a dispersive agent) and cast on glass slides. Upon evaporation of the solvent, coatings of ∼50 μm in thickness of a CuS-poly(acrylic acid) composite are formed. Measurement of sheet resistance (R□) indicates a percolation threshold of electrical conduction at a weight fraction [wf is wt. % of CuS to poly(acrylic acid) + CuS] of about 40%; the composite undergoes a transition from insulator (R□ ∼ 1013 Ω) to conductive state (R□ ∼ 102 Ω). The morphology and thermal stability of the composite depend on the choice of the dispersive agent for the CuS powder; smoother and thermally stable (up to a temperature of 250 °C) coatings are obtained when propylene glycol is used. The results on x-ray diffraction, thermogravimetric analysis, and Fourier transform infrared spectroscopy studies are given to indicate the structure and bonding mechanisms and their dependence on temperature and dispersive agents.

Type
Articles
Information
Journal of Materials Research , Volume 11 , Issue 3 , March 1996 , pp. 739 - 745
Copyright
Copyright © Materials Research Society 1996

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