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Small Area X-Ray Diffraction Techniques; Applications of the Micro-Diffractometer to Phase Identification and Strain Determination

Published online by Cambridge University Press:  06 March 2019

C.C. Goldsmith
Affiliation:
IBM General Technology Division, East Fishkill Facility, Hopewell Junction, New York 12533
G.A. Walker
Affiliation:
IBM General Technology Division, East Fishkill Facility, Hopewell Junction, New York 12533
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Abstract

The trend towards smaller devices and packages in the semiconductor industry makes it increasingly important and increasingly difficult to obtain useful X-ray diffraction information from the small areas employed. This study covers applications of a Rigaku micro-diffractometer to measure strain and obtain phase information from areas less than 100μm in diameter. Examples of residual stress mappings between electrical vias only 100μm apart and phase determination on a single electrical via 120μm diameter will be shown.

Type
II. X-Ray Strain and Stress Determination
Copyright
Copyright © International Centre for Diffraction Data 1983

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References

1. Rigaku, U.S.A., Inc., Danvers, Ma.Google Scholar
2. Walker, G.A. and Goldsmith, C.C., 16th Annual Proceedings of Reliability Physics, 56, (1978).Google Scholar
3. Blodgett, Albert J., Jr., Scientific American, 249, 86, (1983).Google Scholar