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Residual Stresses and Differential Deformation of Electroplated Structures

Published online by Cambridge University Press:  06 March 2019

G. Sheikh  and
I. C. Noyan
G. Sheikh
Affiliation:
Dept. of Metallurgical Engineering, Henry Krumb School of Mines, Columbia University New York, NY Thomas J. Watson Research Center IBM Research Division Yorktown Heights, NY
I. C. Noyan
Affiliation:
Dept. of Metallurgical Engineering, Henry Krumb School of Mines, Columbia University New York, NY Thomas J. Watson Research Center IBM Research Division Yorktown Heights, NY
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Abstract

We report the results of a recent study where nickel substrates electroplated with chromium were loaded in-situ on an x-ray diffractometer. This technique allows determination of lattice spacings in the vicinity of the interface for both the film and the substrate as a function of the applied load. We used such lattice parameter data, SEM observations of the surface and x-ray peak breadth data to study the partitioning of deformation between the film and the substrate. The data indicates progressive loss of adhesion between the film and the substrate with increasing deformation. We observe significant effect of electroplating residual stresses on the mechanical behavior of the system. The loss of adhesion between the film and the substrate coupled with the initial residual stress profile causes an apparent 'negative Poisson's ratio' for the film during initial stages of the loading. This effect disappears with cyclic loading and unloading.

Type
Research Article
Information
Advances in X-Ray Analysis , Volume 33: Thirty-Eighth Annual Conference on Applications of X-ray Analysis, July 31 - August 4, 1989 , 1989 , pp. 161 - 169
Copyright
Copyright © International Centre for Diffraction Data 1989

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References

1. Hardwick, D. A., The Mechanical Properties of Thin Films, Thin Solid Films, 154: 109 (1987).Google Scholar
2. Dudderar, T. D. and Koch, F. B., Mechanical Property Measurements on Electrodeposited Metal Foils, in “Properties of Electrodeposits Their Measurement and Significance”, Sard, R., Leidheiser, II. and Ogbum, F. eds., vol. 187, The Electrochemical Society, Inc., Pennington, N. I (1975).Google Scholar
3. Rickerby, D. S., A Review of the Methods for the Measurement of Coating-Substrate Adhesion, Surf and Coating Tech, 36: 541 (1988).Google Scholar
4. Safranek, W. II., “The Properties of Electrodeposited Metals and Alloys”, Elsevier, New York (1986).Google Scholar
5. Rolff, R., Significance of Ductility and New Methods of Measuring the Same, in: “Testing of Metallic and Inorganic Coatings”, Harding, W. B. and Di Bari, G. A. eds., vol. 947, ASTM, Fairfield, PA (1987).Google Scholar
6. Doerner, M. T. and Nix, W. D., Stresses and Deformation Processes in Thin Film son Substrates, CRC Critical Reviews in Solid State and Materials Science vol. 14, issue 3 (1988).Google Scholar
7. Noyan, I. C. and Cohen, J. B., “Residual Stress Measurement by Diffraction and Interpretationl”, Springer-Verlag Inc., New York (1987).Google Scholar
8. Segmuller, A., Noyan, I. C. and Speriosu, V. S., X-Ray Diffraction Studies of Thin Films and Multilayer Structures, Prog, Crystal Growth and Charact., 18: 21 (1989).Google Scholar
9. Fry, II., A Study of Cracking in Chromium Deposits, Trans. Inst. Met. Fininshing, 32: 107 (1955).Google Scholar
10. McCormick, M. and Dobson, S. J., Characterises and Properties of Electrodeposited Chromium from Solutions with Varying Sulphate Ratios, Trans. Inst. Met. Finishing, 65: 24 (1987).Google Scholar
11. Ilu, M. S. and Evans, A. G., The Cracking and Decohesion of Thin Films on Ductile Substrates, Acta metall., 37: 917 (1989).Google Scholar