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In-Situ Study of Dynamic Structural Rearrangements During Stress Relaxation

Published online by Cambridge University Press:  06 March 2019

A. D. Westwood ,
C. E. Murray  and
I. C. Noyan
A. D. Westwood
Affiliation:
IBM, Thomas J. Watson Research Center Yorktown Heights, NY
C. E. Murray
Affiliation:
IBM, Thomas J. Watson Research Center Yorktown Heights, NY
I. C. Noyan
Affiliation:
IBM, Thomas J. Watson Research Center Yorktown Heights, NY
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Abstract

We have conducted in-situ, real-time x-ray diffraction experiments to probe the dynamic structural changes occurring in copper during loading and then on relaxation. The 331 KαI, KαII peaks were used to monitor the development of elastic strains during loading, and their response during relaxation. The peak width was studied to better understand the structural changes that occur during loading, and more importantly on relaxation, since it is these structural rearrangements that reduce the overall strain in the system and allow the stress to relax.

The results revealed that the structure is highly mobile immediately following the start of stress relaxation. The mobility decreases with time, scales with the magnitude of the applied strain and is highly dependent upon the applied strain rate. In addition, it was apparent that the KαI and KαII peaks do not respond in the same way to the elastic strains and that they also show different structural rearrangements. This suggests an in homogeneous distribution of displacements within the sample.

Type
III. Applications of Diffraction to Semiconductors and Films
Information
Advances in X-Ray Analysis , Volume 38: Forty-third Annual Conference on Applications of X-ray Analysis , 1994 , pp. 243 - 254
Copyright
Copyright © International Centre for Diffraction Data 1994

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References

1. Dotsenko, V. I., Phys. Stat, Solidi B, 93, H-43, 1979.Google Scholar
2. Feltham, P. and Kauser, N., Phys. Stat. Solidi B, 133, 349–362, 1992.Google Scholar
3. Krausz, A. S. and Eyring, H., Deformation Kinetics, published by John Wiley & Sons, Inc., New York, 1975.Google Scholar
4. Honeycombe, R. W. K., Plastic Deformation of Metals, published by Edward Arnold, Ltd., London, 1968.Google Scholar
5. Dieter, G. E., Mechanical Metallurgy, published by McGraw-Hill International Book Co., London, 1981.Google Scholar
6. Flinn, P. A., Gardner, D. S. and Nix, W. D., IEEE Tram. Electron. Devices, ED-34, 689–699, 1987.Google Scholar
7. Thouless, M. D., Gupta, J. and Harper, J. M. E., J. Mater. Res., 8”, 1845–1852, 1993.Google Scholar
8. Marion, R. H. and Cohen, J. B., Adv. X-ray Anal., 20, 355, 1977.Google Scholar
9. Noyau, I. C., Proceedings of the 4th International Conference on Residual Stresses, published by Society for Experimental Mechanics, Bethel, CT, 361–371, 1994.Google Scholar
10. Masing, G., Wiss. Veroff. Siemens Konz., 3, 231–239, 1923.Google Scholar
11. Masing, G., Wiss. Veroff. Siemens Konz., 6, 135–141, 1926.Google Scholar
12. Smith, S. L. and Wood, W. A., Proc. Roy. Soc. A, 176, 398–411, 1940.Google Scholar
13. Taylor, A., X-Ray Metallography, published by John Wiley & Sons, Inc., New York, Chapter 15, 1961.Google Scholar
14. Noyan, I. C., Measurement of Residual and Applied Stress Using Neutron Diffraction, edited by Hutchings, M. T. and Krawitz, A. D., published by Kluwer Academic Publishers, Dordrecht, The Netherlands, NATO ASI Series, Series E: Applied Sciences 216, 51–65, 1992.Google Scholar
15. Kuhlmann-Wilsdorf, D., Phys. Stat. Solidi A, 104, 121–144, 1987.Google Scholar
16. Cullity, B. D., Elements of X-ray Diffraction, 2nd edition, published by Addison-Wesley Publishing Co., Inc., Reading, MA, 1978.Google Scholar
17. Westwood, A. D., Liuiger, E. G. and Cook, R. F., submitted to J. Mater. Res., 1994.Google Scholar