Crossref Citations
This Book has been
cited by the following publications. This list is generated based on data provided by Crossref.
Hodaj, F.
Liashenko, O.
Gusak, A.
and
Lyashenko, Y.
2011.
Heterogeneous nucleation and depletion effect in nanowire growth.
Philosophical Magazine,
Vol. 91,
Issue. 33,
p.
4200.
Li, Menglu
Periasamy, Prakash
Tu, K. N.
and
Iyer, Subramanian S.
2016.
Optimized Power Delivery for 3D IC Technology Using Grind Side Redistribution Layers.
p.
2449.
Chen, Chih
Liu, Chien-Min
Lin, Han-wen
Huang, Yi-Sa
Chu, Yi-Cheng
Lyu, Dian-Rong
Chen, Kuan-Neng
and
Tu, K. N.
2016.
Low-temperature and low-pressure direct copper-to-copper bonding by highly (111)-oriented nanotwinned Cu.
p.
1.
Gusak, Andriy
Zaporozhets, Tetiana
and
Janczak-Rusch, Jolanta
2017.
Kinetic pinning versus capillary pinning of voids at the moving interface during reactive diffusion.
Philosophical Magazine Letters,
Vol. 97,
Issue. 1,
p.
1.
Juang, Jing-Ye
Lu, Chia-Ling
Chen, Kuan-Ju
Chang, Tao-Chih
and
Chen, Chih
2017.
Copper-to-copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambient.
p.
199.
Wang, Yaodong
Liu, Yingxia
Li, Menglu
Tu, K. N.
and
Xu, Luhua
2017.
3D Microelectronic Packaging.
Vol. 57,
Issue. ,
p.
375.
Juang, Jing-Ye
Lu, Chia-Ling
Chen, Kuan-Ju
Chen, Chao-Chang A.
Hsu, Po-Ning
Chen, Chih
and
Tu, K. N.
2018.
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient.
Scientific Reports,
Vol. 8,
Issue. 1,
Morozovych, V. V.
Honda, A. R.
Lyashenko, Yu. O.
Korol, Ya. D.
Liashenko, O. Yu.
Cserháti, С.
and
Gusak, A. M.
2018.
Influence of Copper Pretreatment on the Phase and Pore Formations in the Solid Phase Reactions of Copper with Tin.
METALLOFIZIKA I NOVEISHIE TEKHNOLOGII,
Vol. 40,
Issue. 12,
p.
1649.
Rahimipour, Somayeh
Zhang, Runjie
Wang, Ke
Skadron, Kevin
Rokhani, Fakhrul Zaman B.
and
Stan, Mircea R.
2019.
MTTF Enhancement Power-C4 Bump Placement Optimization.
IEEE Transactions on Very Large Scale Integration (VLSI) Systems,
Vol. 27,
Issue. 7,
p.
1633.
Juang, Jing Ye
Shie, Kai Cheng
Hsu, Po-Ning
Li, Yu Jin
Tu, K N
and
Chen, Chih
2019.
Low-Resistance and high-Strength Copper Direct Bonding in no-Vacuum Ambient Using Highly (111)-Oriented Nano-Twinned Copper.
p.
642.
Motyka, Maciej
Nowak, Wojciech J.
Wierzba, Bartek
and
Chrominski, Witold
2020.
Characterization of the Interface Between α and β Titanium Alloys in the Diffusion Couple.
Metallurgical and Materials Transactions A,
Vol. 51,
Issue. 12,
p.
6584.
Liang, Xianfeng
Matyushov, Alexei
Hayes, Patrick
Schell, Viktor
Dong, Cunzheng
Chen, Huaihao
He, Yifan
Will-Cole, Alexandria
Quandt, Eckhard
Martins, Pedro
McCord, Jeffrey
Medarde, Marisa
Lanceros-Mendez, Senentxu
van Dijken, Sebastiaan
Sun, Nian X.
and
Sort, Jordi
2021.
Roadmap on Magnetoelectric Materials and Devices.
IEEE Transactions on Magnetics,
Vol. 57,
Issue. 8,
p.
1.
Yarmolenko, Mykhaylo V.
2021.
Intrinsic Diffusivities Ratio Analysis in Double Multiphase Systems.
Defect and Diffusion Forum,
Vol. 413,
Issue. ,
p.
47.
Wang, Yaodong
Liu, Yingxia
Li, Menglu
Tu, K. N.
and
Xu, Luhua
2021.
3D Microelectronic Packaging.
Vol. 64,
Issue. ,
p.
527.
Zhang, Simian
Deng, Xiaonan
Wang, Yuqi
Wu, Yifei
Liu, Jianing
Li, Zhengcao
Cai, Jian
and
Wang, Chen
2023.
Revolution of next-generation interconnect materials and key processes for advanced chips in post-moore era.
SCIENTIA SINICA Chimica,
Vol. 53,
Issue. 10,
p.
2027.
Lu, Tsan-Feng
Hsu, Kai-Ning
Hsu, Ching-Chi
Hsu, Chia-Yu
and
Wu, YewChung Sermon
2024.
Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism.
Materials,
Vol. 17,
Issue. 9,
p.
2150.
Lu, Tsan-Feng
Lee, Ping-Yang
and
Wu, YewChung Sermon
2024.
Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging.
Materials,
Vol. 17,
Issue. 10,
p.
2236.