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2 - Conduction Heat Transfer Analysis

Published online by Cambridge University Press:  19 June 2020

Eric A. Silk
Affiliation:
University of Maryland, College Park
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Summary

Thermal conduction is one of the two primary heat transfer mechanisms present on space-based platforms. The goal of this chapter is to establish proficiency in the design and interpretation of thermal conductance resistance networks. The geometries studied are assemblies and/or sub-assemblies with multiple components of variable shapes and sizes.

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Chapter
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Publisher: Cambridge University Press
Print publication year: 2020

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