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The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
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- Journal:
- Journal of Materials Research / Volume 19 / Issue 6 / June 2004
- Published online by Cambridge University Press:
- 03 March 2011, pp. 1608-1612
- Print publication:
- June 2004
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- Article
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