We formed titanium Ohmic contacts to n-type 6H-SiC epitaxial layer byreducing the Schottky barrier heights. The barrier heights were reduced enough toform the Ohmic contacts by releasing the Fermi level from pinning through makingatomically-flat surfaces. The current transport by thermionic emission wasdominant at the Ti/SiC interface. Since the Ti contacts were formed without postannealing,surfaces of the Ti electrodes were flat and homogeneous maintaining asdepositedstructures. Contact resistivity was (6±1)×10−3 Ω-cm2, which is comparableto that of the annealed Ni contact formed on the SiC epitaxial layer with the samecarrier concentration.