Water tracks are zones of high soil moisture that route shallow groundwater down-slope, through the active layer and above the ice table. A water track in Taylor Valley, McMurdo Dry Valleys, was analysed for surface hydrogeological, geochemical, and biological characteristics in order to test the hypothesis that water tracks provide spatial structure to Antarctic soil ecosystems by changing the physical conditions in the soil environment within the water tracks from those outside the water tracks. The presence of the water track significantly affected the distribution of biotic and abiotic ecosystem parameters: increasing soil moisture, soil salinity, and soil organic matter within the water track relative to soils outside the water track, and reducing soil phosphate, soil pH, and the population of nematodes and other invertebrates in water track soils relative to off track soils. These results suggest that water tracks are distinct and extreme ecological zones in Taylor Valley that provide long-range (kilometre to multi- kilometre) structure to Antarctic hillslope ecosystems through physical control on soil moisture and solute content. Contrary to expectations, these high soil-moisture sites are not hotspots for faunal biological activity because high soil salinity makes them suitable habitats for only the most halo-tolerant organisms.

Knowledge of the mechanical properties of interlevel dielectric films and their impact on sub-micron interconnect reliability is becoming more and more important as critical dimensions in ULSI circuits are scaled down. For example, lateral aluminum (Al) extrusions into spaces between metal lines, which become a more of a concern as the pitches shrink, appear to depend partially on properties of SiO2 underlayers. In this paper, the mechanical properties of several common interlevel dielectric SiO2 films such as undoped silica glass using a silane (SiH4) precursor, undoped silica glass using a tetraethylorthosilicate (TEOS) precursor, phosphosilicate glass (PSG) deposited by plasma-enhanced chemical vapor deposition (PECVD) and borophosphosilicate glass (BPSG) deposited by sub-atmosphere chemical vapor deposition (SACVD) were studied. Among the four common interlevel layers, BPSG exhibits the smallest modulus (E), hardness (H) and the highest the coefficients of thermal expansion (CTE). BPSG again has the lowest as-deposited compressive stress and the lowest local Si-O-Si strain before annealing. Stress interactions between the various SiO2 underlayers and the Al metal film are further investigated. The impact of dielectric elastic properties on interconnect reliability during thermal cycles is proposed.

The in vitro activities of bacitracin and mupirocin were compared for seven different strains of methicillin-resistant Staphylococcus aureus. Six of seven strains showed bacitracin minimum inhibitory concentrations (MICs) of 0.5 to 1.0 units/mL, and all seven had mupirocin MICs of 0.5 to 2 μg/mL. Time-kill studies revealed 2.6- to 4.5-log reduction in 24 hours with strains susceptible to bacitracin (4 units/mL) and 0 to 2.2 reduction with mupirocin (16 μg/mL). Bacitracin should be considered further for in vivo studies because of enhanced bacteriocidal effect and lower cost.