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Parylene VIPTM AF-4 dielectric is a potential low εR candidate for ULSI manufacture. The search for new IMD materials with low dielectric constant (k ≤ 2.5) to enable sub 0.18 micron technologies is focusing on new polymers, deposited by either spinning or CVD methods. Two classes of requirements have to be satisfied for a material to be successful, i.e., used in volume device manufacturing. First, a set of physical characteristics have to be met, among the most important are thermal stability above 400 °C, mechanical stability, and good adhesion to a variety of substrates. Then, a second set of more stringent requirements have to be met related to device integration. For example, electrical performance in a device and dry etching for via formation. We report results on the evaluation of Parylene AF-4, deposited by vapor-deposition polymerization of tetrafluoro-p-xylylene. We present data on deposition characteristics, film composition and purity, thermal stability as well as preliminary electrical data.
A shallow acceptor-like defect labeled “A” is frequently incorporated in molecular beam epitaxial GaAs. We report here anomalous photoluminescence effects that are induced by this defect. With increasing concentration of the “A” defect: (1) neutral and ionized donor-bound exciton peaks disappear almost completely even for donor concentration as high as 7×1014 cm-3 and compensation ratio ND/NA≈0.3; (2) a new, sharp line emerges at 1.5138 eV, and (3) the relative intensity and line shape of the free exciton transition change dramatically. These observations are discussed in the perspective of previous reports, where similar effects were, in our opinion, misinterpreted.
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