Using nanoindentation, this study develops the criteria to evaluate the creep performance of the intermetallic compounds (IMCs) formed at the interface of microelectronic solder joints. Regardless of crystal structure and melting point, the creep stress exponent (X), one of the parameters determining creep resistance, is in good agreement with tendencies of the work-hardening exponent (n) and also the ratio of yield stress (Y) to Young's modulus (E), which reveals the ability against plastic deformation.

The effect of minor transition metal (TM) additives of Ni, Co, or Zn on the interfacial reactions of the solder joints between Sn–Ag–Cu (SAC) solder and the Cu/Ni(P)/Au substrate was investigated, especially subsequent to multi-reflowing. (Cu,Ni)6Sn5 formed at the interface of all the joints except that of SAC–Ni, of which the interfacial compound was (Ni,Cu)6Sn5. The interfacial compounds of the SAC–Co and SAC–Zn contained a small amount of alloying elements of less than 3 at.%. Two P-rich layers, Ni3P and Ni–Sn–P emerged at the interface of the SAC joints. Nanoindentation analysis indicates that the hardness and Young’s modulus of these two phases were slightly higher than those of the Ni(P) substrate, which were in turn much greater than those of the Cu–Ni–Sn compounds. Worthy of notice is that with TM additions, the Ni–Sn–P phase between Ni3P and interfacial compounds was absent even after 10 reflows. For the SAC–Co joints, the growth of Ni-containing intermetallic compounds within the solder gave rise to the excess Ni dissolution, which caused a discrete Ni3P layer and over-consumed Ni(P) substrate underneath the grooves in-between (Cu, Ni)6Sn5 scallop grains at the interface. This phenomenon is presented for the first time, and the mechanism is proposed in this study.

This study investigated the behavior of Cu-containing intermetallic compounds (IMCs) in liquid Sn–Ag and Sn–Zn solders. Experimental results show that for the intermetallics investigated, Cu–Sn and Cu–Zn compounds, the occurrence of settling was dominated by the crystalline temperature of IMCs, buoyancy due to difference in densities, and dissolution potential for the compounds into the liquid. The complete dissolution of Cu–Zn compounds, which took place in the Sn–Zn solders when the Cu content exceeded a critical value, might be ascribed to the depletion of Zn in the melt.

In this study, we investigated the vibration properties of Sn–Zn and Sn–Zn–Al alloys. It is notable that, with a small amount of Al addition, Sn whiskers were generated during resonant vibration. This may be the first time that Sn whiskers were found on bulk materials. Microstructural refining and hardening caused by alloying of Al stunted the fiberous type Sn deformation within Sn–Zn eutectics. Vibration-induced extrusion of Zn-free regions in the vicinity of cell boundaries may account for the appearance of the whiskers.

In the Sn–9Zn–xAg (x ranges from 0.5 to 3.0%) solder system, the Ag–Zn intermetallics start crystallizing as β–AgZn at about 300 °C. Subsequently, the solder experiences two peritectic transformations upon solidification. This results in the multiphase structural feature. The complicated crystallization process can be briefly described as L(liquid) → L + AgZn → L + AgZn + Ag5Zn8 → AgZn + Ag5Zn8 + AgZn3.

This study investigated the vibration fracture properties of Sn–Ag–Cu alloys with various Cu contents. Results show that the microstructure becomes finer with a higher Cu content. This leads to a lower damping capacity, higher deflection amplitude, and thus inferior vibration fracture resistance under a constant vibration force. It is of interest that when the Cu content reaches 1.5 wt%, the specimen possesses the highest damping capacity and greatest vibration life. The presence of massive primary Cu6Sn5 intermetallics probably accounts for this phenomenon.

This study investigated the characteristics of the intermetallics that appear in Sn–Zn–Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε–AgZn3 and γ–Ag5Zn8. These Ag–Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300 °C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250 °C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300 °C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.