7 results
Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints
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- Journal:
- Journal of Materials Research / Volume 25 / Issue 4 / April 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 629-632
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- April 2010
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Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections
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- Journal:
- Journal of Materials Research / Volume 23 / Issue 9 / September 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2545-2554
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- September 2008
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Sedimentation of Cu-rich intermetallics in liquid lead-free solders
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- Journal:
- Journal of Materials Research / Volume 22 / Issue 12 / December 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 3432-3439
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- December 2007
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Tin Whiskers of Bulk Solders Generated Under Resonance
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- Journal of Materials Research / Volume 20 / Issue 6 / June 2005
- Published online by Cambridge University Press:
- 01 June 2005, pp. 1385-1388
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- June 2005
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Double peritectic behavior of Ag–Zn intermetallics in Sn–Zn–Ag solder alloys
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- Journal of Materials Research / Volume 19 / Issue 9 / September 2004
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- 03 March 2011, pp. 2719-2724
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- September 2004
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Investigation of vibration fracture behavior of Sn–Ag–Cu solders under resonance
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- Journal:
- Journal of Materials Research / Volume 19 / Issue 9 / September 2004
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- 03 March 2011, pp. 2665-2673
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- September 2004
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Behavior of intermetallics in liquid Sn–Zn–Ag solder alloys
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- Journal:
- Journal of Materials Research / Volume 18 / Issue 9 / September 2003
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2060-2067
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- September 2003
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