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Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking
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- Journal:
- MRS Communications / Volume 10 / Issue 4 / December 2020
- Published online by Cambridge University Press:
- 07 October 2020, pp. 549-557
- Print publication:
- December 2020
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Strained Silicon On Insulator wafers made by the Smart Cut™ technology
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- Journal:
- MRS Online Proceedings Library Archive / Volume 809 / 2004
- Published online by Cambridge University Press:
- 17 March 2011, B2.3
- Print publication:
- 2004
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Dislocation Networks Strain Fields Induced By Si Wafer Bonding.
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- Journal:
- MRS Online Proceedings Library Archive / Volume 673 / 2001
- Published online by Cambridge University Press:
- 18 March 2011, P6.9
- Print publication:
- 2001
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Investigations of Buried Interfaces Using High Energy X-Ray Reflectivity
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- Journal:
- MRS Online Proceedings Library Archive / Volume 678 / 2001
- Published online by Cambridge University Press:
- 21 March 2011, EE9.9.1
- Print publication:
- 2001
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Trace Element Mapping of Minerals and Materials by Electron Microprobe
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- Journal:
- Microscopy and Microanalysis / Volume 5 / Issue S2 / August 1999
- Published online by Cambridge University Press:
- 02 July 2020, pp. 630-631
- Print publication:
- August 1999
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