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Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
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- Journal:
- Journal of Materials Research / Volume 26 / Issue 16 / 28 August 2011
- Published online by Cambridge University Press:
- 16 August 2011, pp. 2103-2116
- Print publication:
- 28 August 2011
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- Article
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