1 results
Preparation of Cross-Section Tem Specimens of Semiconductors Containing Tungsten Interconnects Using Chemical Mechanical Polishing and Chemically Assisted ion Beam Milling, and Use of Afm to Evaluate the Success of These Procedures
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 480 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 201
- Print publication:
- 1997
-
- Article
- Export citation