7 results
Formation of Al Nanodot Array by the Combination of Nano-Indentation and Anodic Oxidation
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- Journal:
- MRS Online Proceedings Library Archive / Volume 705 / 2001
- Published online by Cambridge University Press:
- 15 March 2011, Y7.13
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- 2001
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Electromigration Reliability Study of a GMR Spin Valve Device
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- Journal:
- MRS Online Proceedings Library Archive / Volume 563 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 145
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- 1999
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Void Elongation Phenomena Observed in Polycrystalline Cu Interconnects at a High Current Density Stressing Conditions
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- Journal:
- MRS Online Proceedings Library Archive / Volume 473 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 229
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- 1997
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Cu Deposition Characteristics into Submicron Contact Holes Employing Self-Sputtering With a High Ionization Rate
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- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 185
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- 1996
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Initial Stage of Titanium Slicide Formation on Si(Lll) Substrate
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- Journal:
- MRS Online Proceedings Library Archive / Volume 402 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 137
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- 1995
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Electromigration Characteristics of Cu and Al Interconnections
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- Journal:
- MRS Online Proceedings Library Archive / Volume 338 / 1994
- Published online by Cambridge University Press:
- 22 February 2011, 441
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- 1994
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Tem Observation of the Damages in Heavily Ion-Implanted Fine Si Columns
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- Journal:
- MRS Online Proceedings Library Archive / Volume 354 / 1994
- Published online by Cambridge University Press:
- 21 February 2011, 641
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- 1994
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