3 results
Solution chemistry effects on cracking and damage evolution during chemical-mechanical planarization
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- Journal:
- Journal of Materials Research / Volume 25 / Issue 10 / October 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1904-1909
- Print publication:
- October 2010
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- Article
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Patterned wafers backside thinning for 3-D Integration and multilayer stack achievement by direct wafer bonding
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1079 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1079-N06-10
- Print publication:
- 2008
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- Article
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CMP-induced Peeling in Multi-level Ultra Low-k / Cu Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F12-07
- Print publication:
- 2006
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