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Shear Strength of Sn–3.5Ag Solder Bumps Formed on Ni/Au and Organic Solderability Preservative Surface-Finished Bond Pads After Multiple Reflow Steps
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- Journal:
- Journal of Materials Research / Volume 20 / Issue 11 / November 2005
- Published online by Cambridge University Press:
- 03 March 2011, pp. 3088-3093
- Print publication:
- November 2005
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- Article
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Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 833 / 2004
- Published online by Cambridge University Press:
- 01 February 2011, G3.1
- Print publication:
- 2004
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- Article
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