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Copper Diffusion Into Aluminum-Silicon Metallizations by Accelerated Thermal and Electrical Stressing
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- Journal:
- MRS Online Proceedings Library Archive / Volume 428 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 219
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- 1996
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Quantitative Three-Dimensional Characterization of the Morphology of Stressed and Electromigrated Aluminum Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 373
- Print publication:
- 1995
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Characterization of Copper Diffusion into Al and Al-1% Si Polycrystalline Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 403 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 663
- Print publication:
- 1995
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