1 results
Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping
-
- Journal:
- Journal of Materials Research / Volume 26 / Issue 21 / 14 November 2011
- Published online by Cambridge University Press:
- 11 October 2011, pp. 2757-2760
- Print publication:
- 14 November 2011
-
- Article
- Export citation