The contact angle (Θ) of molten Sn and Sn-Ag alloys (0.5, 1.5, 3.5, 6 wt.% Ag)
on Cu substrates have been studied by using sessile drop method at various temperatures (230, 250, 275
and 300 °C). Experimental results showed that additions of Ag to Sn resulted in a continuous decrease
in the Θ up to 3.5 wt.% above which the Θ value was increased. Increasing alloy temperature
also decreased the Θ proportionally. Experimental results revealed that a correlation between the Θ,
alloy composition and the alloy temperature exists which yielded an empirical model to predict the Θ at a given
Ag content and temperature for a given Sn-Ag alloy. The empirical model predicts the Θ reasonably well with
the present work and the other published works.